Recently added

How much rear side polishing is required? A study on the impact of rear side polishing in PERC solar cells

Cornagliotti, Emanuele; Uruena De Castro, Angel; Horzel, Jörg; John, Joachim; Tous, Loic; Hendrickx, Dirk; Prajapati, Victor; Singh, Sukhvinder; Hoyer, Ronald; Delahaye, Franck; Weise, K.; Queisser, D.; Nussbaumer, H.; Poortmans, Jef (2012)

Integration of inline single-side wet emitteretch in PERC cell manufacturing

Cornagliotti, Emanuele; Ngamo, Michel; Tous, Loic; Russell, Richard; Horzel, Jörg; Hendrickx, Dirk; Douhard, Bastien; Prajapati, Victor; Janssens, Tom; Poortmans, Jef (2012)

Organic solar cell composition profiling by large clusters ions: How can we optimize the information retrieved?

Conard, Thierry; Franquet, Alexis; Voroshazi, Eszter; Cheyns, David; Vandervorst, Wilfried (2012)

De l'interet des spectroscopies électroniques pour le développement de nouveaux matériaux en microélectronique

Conard, Thierry; Franquet, Alexis; Vandervorst, Wilfried (2012)

Résolution spatiale de l'information chimique

Conard, Thierry (2012)

New materials and device concepts for scaling nano-electronics beyond the Si roadmap

Collaert, Nadine (2012-09)

On the diffusion process of electronically active defects in amorphous HfOx

Clima, Sergiu; Chen, Yangyin; Govoreanu, Bogdan; Jurczak, Gosia; Altimime, Laith; Pourtois, Geoffrey (2012)

Low intensity inelastic photon scattering in silicon wire waveguide below the bandgap

Clemmen, S.; Perret, A.; Safioui, J.; Bogaerts, Wim; Baets, Roel; Gorza, S.-P.; Emplit, Ph.; Massar, S. (2012-05)

Advanced characterization of carrier profiles in germanium using micro-machined contact probes

Clarysse, Trudo; Konttinen, Mikko; Parmentier, Brigitte; Moussa, Alain; Vandervorst, Wilfried; Impellizzeri, Giuliana; Napolitani, Enrico; Privitera, Vittorio; Nielsen, Peter F.; Petersen, Dirch H.; Hansen, Ole (2012)

Contact technology schemes for advanced Ge and III-V CMOS technologies

Claeys, Cor; Firrincieli, Andrea; Martens, Koen; Kittl, Jorge; Simoen, Eddy (2012)

Radiation hardness aspects of advanced FinFET and UTBOX devices

Claeys, Cor; Aoulaiche, Marc; Simoen, Eddy; Griffoni, Alessio; Kobayashi, D.; Mahatme, N.N.; Reed, R.A.; Schrimpf, R.D.; Agopian, P.G.D.; Martino, J.A. (2012)

Low frequency noise performance of state-of-the-art and emerging CMOS devices

Claeys, Cor; Aoulaiche, Marc; Andrade, M.G.C.; Rodrigues, Michele; Martino, J.A.; Simoen, Eddy (2012)

Trends and challenges in micro- and nanoelectronics for the next decade

Claeys, Cor (2012)

Towards a silicon dual polarization ring resonator sensor for multiplexed and label-free structural analysis of molecular interactions

Claes, Tom; Vermeulen, Diedrik; De Heyn, Peter; De Vos, K.; Roelkens, Gunther; Van Thourhout, Dries; Bienstman, Peter (2012)

Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections

Civale, Yann; Redolfi, Augusto; Velenis, Dimitrios; Heylen, Nancy; Beynet, Julien; Jung, Insoo; Woo, Jeong-Jun; Swinnen, Bart; Beyer, Gerald; Beyne, Eric (2012)

Through-silicon via technology for three-dimensional integrated circuit manufacturing

Civale, Yann; Redolfi, Augusto; Jaenen, Patrick; Kostermans, Maarten; Van Besien, Els; Mertens, Sofie; Witters, Thomas; Jourdan, Nicolas; Armini, Silvia; Vandersmissen, Kevin; Philipsen, Harold; Verdonck, Patrick; Heylen, Nancy; Nolmans, Philip; Li, Yunlong; Croes, Kristof; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012)

Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects

Civale, Yann; Armini, Silvia; Philipsen, Harold; Redolfi, Augusto; Velenis, Dimitrios; Croes, Kristof; Heylen, Nancy; El-Mekki, Zaid; Vandersmissen, Kevin; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012)

Conference contributions: Recent submissions

How much rear side polishing is required? A study on the impact of rear side polishing in PERC solar cells

Integration of inline single-side wet emitteretch in PERC cell manufacturing

Organic solar cell composition profiling by large clusters ions: How can we optimize the information retrieved?

De l'interet des spectroscopies électroniques pour le développement de nouveaux matériaux en microélectronique

Résolution spatiale de l'information chimique

New materials and device concepts for scaling nano-electronics beyond the Si roadmap

On the diffusion process of electronically active defects in amorphous HfOx

Low intensity inelastic photon scattering in silicon wire waveguide below the bandgap

Advanced characterization of carrier profiles in germanium using micro-machined contact probes

Contact technology schemes for advanced Ge and III-V CMOS technologies

Radiation hardness aspects of advanced FinFET and UTBOX devices

Low frequency noise performance of state-of-the-art and emerging CMOS devices

Trends and challenges in micro- and nanoelectronics for the next decade

Towards a silicon dual polarization ring resonator sensor for multiplexed and label-free structural analysis of molecular interactions

Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections

Through-silicon via technology for three-dimensional integrated circuit manufacturing

Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects

Low f-number microlens array fabricated in thick resist

Self-controlled constant-current temperature stress for triangular voltage sweep measurements of Cu

Demonstration of low-power bit interleaving TDM PON

Conference contributions: Recent submissions

How much rear side polishing is required? A study on the impact of rear side polishing in PERC solar cells ﻿

Integration of inline single-side wet emitteretch in PERC cell manufacturing ﻿

Organic solar cell composition profiling by large clusters ions: How can we optimize the information retrieved? ﻿

De l'interet des spectroscopies électroniques pour le développement de nouveaux matériaux en microélectronique ﻿

Résolution spatiale de l'information chimique ﻿

New materials and device concepts for scaling nano-electronics beyond the Si roadmap ﻿

On the diffusion process of electronically active defects in amorphous HfOx ﻿

Low intensity inelastic photon scattering in silicon wire waveguide below the bandgap ﻿

Advanced characterization of carrier profiles in germanium using micro-machined contact probes ﻿

Contact technology schemes for advanced Ge and III-V CMOS technologies ﻿

Radiation hardness aspects of advanced FinFET and UTBOX devices ﻿

Low frequency noise performance of state-of-the-art and emerging CMOS devices ﻿

Trends and challenges in micro- and nanoelectronics for the next decade ﻿

Towards a silicon dual polarization ring resonator sensor for multiplexed and label-free structural analysis of molecular interactions ﻿

Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections ﻿

Through-silicon via technology for three-dimensional integrated circuit manufacturing ﻿

Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects ﻿

Low f-number microlens array fabricated in thick resist ﻿

Self-controlled constant-current temperature stress for triangular voltage sweep measurements of Cu ﻿

Demonstration of low-power bit interleaving TDM PON ﻿

How much rear side polishing is required? A study on the impact of rear side polishing in PERC solar cells

Integration of inline single-side wet emitteretch in PERC cell manufacturing

Organic solar cell composition profiling by large clusters ions: How can we optimize the information retrieved?

De l'interet des spectroscopies électroniques pour le développement de nouveaux matériaux en microélectronique

Résolution spatiale de l'information chimique

New materials and device concepts for scaling nano-electronics beyond the Si roadmap

On the diffusion process of electronically active defects in amorphous HfOx

Low intensity inelastic photon scattering in silicon wire waveguide below the bandgap

Advanced characterization of carrier profiles in germanium using micro-machined contact probes

Contact technology schemes for advanced Ge and III-V CMOS technologies

Radiation hardness aspects of advanced FinFET and UTBOX devices

Low frequency noise performance of state-of-the-art and emerging CMOS devices

Trends and challenges in micro- and nanoelectronics for the next decade

Towards a silicon dual polarization ring resonator sensor for multiplexed and label-free structural analysis of molecular interactions

Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections

Through-silicon via technology for three-dimensional integrated circuit manufacturing

Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects

Low f-number microlens array fabricated in thick resist

Self-controlled constant-current temperature stress for triangular voltage sweep measurements of Cu

Demonstration of low-power bit interleaving TDM PON