Recently added

Internal photoemission at interfaces of ALD TaiOx insulating layers deposited on Si, InP and In0.53Ga0.47As

Chou, H.-Y.; Afanasiev, Valeri; Thoan, N.H.; Adelmann, Christoph; Lin, Dennis; Houssa, Michel; Stesmans, Andre (2012)

Analysis of power efficiency of schedulers in LTE

Chiumento, Alessandro; Pollin, Sofie; Desset, Claude; Van der Perre, Liesbet; Lauwereins, Rudy (2012)

Successful experimental validation of an integrated burst mode receiver designed for 10G-GPON systems in a packet-OADM metro network

Chiaroni, Dominique; Yin, Xin; Qiu, Xing Zhi; Gillis, Jan; Put, Jasmien; Bauwelinck, Johan; Lanteri, Delphine; Blache, Fabrice; Achouche, Mohand; Gripp, Jurgen (2012)

Power dynamics control in optical packet rings

Chiaroni, Dominique; De Valicourt, Guilhem; Achouche, Mohand; Blache, Fabrice; Yin, Xin; Qiu, Xing Zhi; Verbrugghe, Jochen; Bauwelinck, Johan (2012)

Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage

Cherman, Vladimir; De Messemaeker, Joke; Croes, Kristof; Dimcic, Biljana; Van der Plas, Geert; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012)

Multiple hypothesis testing for compressive wideband sensing

Chepuri, Sundeep; De Francisco Martin, Ruben (2012)

Low-power architecture fir wdeband spectrum sensing

Chepuri, Sundeep; De Francisco Martin, Ruben (2012)

Hf cap thickness dependence in bipolar-switching TiN\HfO2\Hf\TiN RRAM device

Chen, Yangyin; Pourtois, Geoffrey; Clima, Sergiu; Govoreanu, Bogdan; Goux, Ludovic; Fantini, Andrea; Degraeve, Robin; Groeseneken, Guido; Wouters, Dirk; Jurczak, Gosia (2012)

Understanding of the endurance failure in scaled HfO2-based 1T1R RRAM through vacancy mobility degradation

Chen, Yangyin; Degraeve, Robin; Clima, Sergiu; Govoreanu, Bogdan; Goux, Ludovic; Fantini, Andrea; Kar, Gouri Sankar; Pourtois, Geoffrey; Groeseneken, Guido; Wouters, Dirk; Jurczak, Gosia (2012)

ESD protection devices placed inside keep-out zone (KOZ) of through silicon via (TSV) in 3D stacked integrated circuits

Chen, Shih-Hung; Thijs, Steven; Linten, Dimitri; Scholz, Mirko; Hellings, Geert; Groeseneken, Guido (2012-09)

Utilizing Keep-Out Zone (KOZ) of Through Silicon Via (TSV) for ESD protection devices in 3D stacking integrated circuits

Chen, Shih-Hung; Thijs, Steven; Linten, Dimitri; Groeseneken, Guido (2012)

Line-end gap measurement with YieldStar scatterometer: towards an OPC model calibration

Charley, Anne-Laure; Leray, Philippe; Cheng, Shaunee; Dusa, Mircea; Chiou, T.-B.; Fumar-Pici, A. (2012)

High selective plasma etching for PMMA of block-copolymer in directed-self assembly

Chan, BT; Tahara, Shigeru (2012)

Effect of film thickness variation on (100)-surface texturing of MPS processed polycrystalline Si films

Chahal, Monica; van der Wilt, Paul C.; Van Gestel, Dries; Limanov, A.B.; Chitu, Adrian M.; Im, James S. (2012)

Charge based compact modeling for bulk FinFETs

Cerdeira, Antonio; Estrada, Magali; Ritzenthaler, Romain; Franco, Jacopo; Togo, Mitsuhiro; Claeys, Cor (2012)

Cu migration in conducting bridging meories as studied by C-AFM

Celano, Umberto; Conard, Thierry; Opsomer, Karl; Goux, Ludovic; Jurczak, Gosia; Vandervorst, Wilfried (2012)

De-process and physical characterization of HfO2 based resistive memory as studied by C-AFM

Celano, Umberto; Chen, Yangyin; Wouters, Dirk; Jurczak, Gosia; Vandervorst, Wilfried (2012)

Epitaxy of III-V based channels on Si and transistor integration for 12-nm node CMOS

Caymax, Matty; Merckling, Clement; Wang, Gang; Orzali, Tommaso; Guo, Weiming; Vandervorst, Wilfried; Dekoster, Johan; Waldron, Niamh; Thean, Aaron (2012)

A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

Cauwe, Maarten; Vandecasteele, Bjorn; De Baets, Johan; van den Brand, Jeroen; Kusters, Roel; Sridhar, Ashok (2012)

On the non-linear MLDA-based variational mtheod: the case of cylindrical nanowires

Carrillo-Nunez, Hamilton; Magnus, Wim; Peeters, Francois (2012)

Conference contributions: Recent submissions

Internal photoemission at interfaces of ALD TaiOx insulating layers deposited on Si, InP and In0.53Ga0.47As ﻿

Analysis of power efficiency of schedulers in LTE ﻿

Successful experimental validation of an integrated burst mode receiver designed for 10G-GPON systems in a packet-OADM metro network ﻿

Power dynamics control in optical packet rings ﻿

Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage ﻿

Multiple hypothesis testing for compressive wideband sensing ﻿

Low-power architecture fir wdeband spectrum sensing ﻿

Hf cap thickness dependence in bipolar-switching TiN\HfO2\Hf\TiN RRAM device ﻿

Understanding of the endurance failure in scaled HfO2-based 1T1R RRAM through vacancy mobility degradation ﻿

ESD protection devices placed inside keep-out zone (KOZ) of through silicon via (TSV) in 3D stacked integrated circuits ﻿

Utilizing Keep-Out Zone (KOZ) of Through Silicon Via (TSV) for ESD protection devices in 3D stacking integrated circuits ﻿

Line-end gap measurement with YieldStar scatterometer: towards an OPC model calibration ﻿

High selective plasma etching for PMMA of block-copolymer in directed-self assembly ﻿

Effect of film thickness variation on (100)-surface texturing of MPS processed polycrystalline Si films ﻿

Charge based compact modeling for bulk FinFETs ﻿

Cu migration in conducting bridging meories as studied by C-AFM ﻿

De-process and physical characterization of HfO2 based resistive memory as studied by C-AFM ﻿

Epitaxy of III-V based channels on Si and transistor integration for 12-nm node CMOS ﻿

A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels ﻿

On the non-linear MLDA-based variational mtheod: the case of cylindrical nanowires ﻿