Recently added

Test and design-for-test of 3D-stacked ICs

Marinissen, Erik Jan (2017-12)

Testing of 2.5D- and 3D-stacked integrated circuits

Marinissen, Erik Jan (2017-09)

3D IC stacking: Do-It-Yourself short course

Marinissen, Erik Jan (2017-08)

Spin on metal oxide materials for N7 and beyond patterning applications

Mannaert, Geert; Altamirano Sanchez, Efrain; Hopf, Toby; Sebaai, Farid; Lorant, Christophe; Petermann, Claire; Hong, S-E; Mullen, S; Wolfer, E; Mckenzie, D; Yao, H; Rahman, D; Cho, J-Y; Padmanaban, M; Piumi, Daniele (2017)

A bottom-up energy simulation framework to accurately compare PV module topologies under non-uniform and dynamic operating conditions

Manganiello, Patrizio; Baka, Maro; Goverde, Hans; Borgers, Tom; Govaerts, Jonathan; van der Heide, Arvid; Voroshazi, Eszter; Catthoor, Francky (2017)

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Mangal, Nivesh; Missinne, Jeroen; Van Steenberge, Geert; Van Campenhout, Joris; Snyder, Brad (2017)

Interconnected MTJs driven by STT for spin-logic applications

Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, M; Sayan, S; Nikonov, D.E.; Manipatruni, S; Young, I. A.; Mocuta, Dan; Radu, Iuliana (2017)

A perturbative approach to predict eye diagram degradation in differential interconnects subject to asymmetry and nonuniformity

Manfredi, Paolo; Wu, Xinglong; Grassi, Flavia; Vande Ginste, Dries; Pignari, Sergio A. (2017)

Worst-case EMC investigation of single-wire transmission lines based on Taylor arithmetic

Manfredi, Paolo; Trinchero, R.; Stievano, S. (2017-08)

The impact of sequential-3D integration on semiconductor scaling roadmap

Mallik, Arindam; Vandooren, Anne; Witters, Liesbeth; Walke, Amey; Franco, Jacopo; Sherazi, Yasser; Weckx, Pieter; Yakimets, Dmitry; Garcia Bardon, Marie; Parvais, Bertrand; Debacker, Peter; Ku, B.W.; Lim, S.K.; Mocuta, Anda; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine; Raghavan, Praveen (2017)

Design-technology co-optimization for OxRRAM-based synaptic processing unit

Mallik, Arindam; Garbin, Daniele; Fantini, Andrea; Rodopoulos, Dimitrios; Degraeve, Robin; Stuijt, Jan; Das, Anup Kumar; Schaafsma, Siebren; Debacker, Peter; Donadio, Gabriele Luca; Hody, Hubert; Goux, Ludovic; Kar, Gouri Sankar; Furnemont, Arnaud; Mocuta, Anda; Raghavan, Praveen (2017)

Photolithography as enabler of AMOLED displays beyond 1000 ppi

Malinowski, Pawel; Ke, Tung Huei; Nakamura, Atsushi; Vicca, Peter; Kronemeijer, Auke; Ameys, Marc; van der Steen, Jan-Laurens; Steudel, Soeren; Kamochi, Yoshitaka; Iwai, Yu; Gelinck, Gerwin; Heremans, Paul (2017)

Monolithic near infrared image sensors enabled by quantum dot photodetector

Malinowski, Pawel; Georgitzikis, Epimitheas; Maes, Jorick; Mamun, Mehedi; Enzing, Oscar; Frazzica, Fortunato; Van Olmen, Jan; De Moor, Piet; Heremans, Paul; Hens, Zeger; Cheyns, David (2017)

SWIR detection with thin-film photodetectors based on colloidal quantum dots

Malinowski, Pawel; Georgitzikis, Epimitheas; Maes, Jorick; Mamun, Mehedi; Enzing, Oscar; Chen, KuoHao; Hadipour, Afshin; Heremans, Paul; Hens, Zeger; Cheyns, David (2017)

Cavity wafer bonding after deep silicon etch

Malainou, Antonia; Majeed, Bivragh; Sabuncuoglu Tezcan, Deniz (2017)

Low-power 1.3- $lm VCSEL transmitter for data center interconnects and beyond

Malacarne, A.; Falconi, F.; Neumeyr, C.; Soenen, Wouter; Porzi, C.; Aalto, T.; Rosskopf, J.; Chiesa, M.; Bauwelinck, Johan; Bogoni, A. (2017-09)

Towards PaaS offering of BPMN 2.0 engines: A proposal for service-level tenant isolation

Makki, Majid; Van Landuyt, Dimitri; Joosen, Wouter (2017)

Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology

Makarov, A; Tyaginov, Stanislaw; Kaczer, Ben; Jech, M.; Vaisman Chasin, Adrian; Grill, A.; Hellings, Geert; Vexler, M.; Linten, Dimitri; Grasser, Tibor (2017)

Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology

Makarov, A.; Tyaginov, S. E.; Kaczer, Ben; Jech, M.; Vaisman Chasin, Adrian; Grill, A.; Hellings, Geert; Vexler, M. I.; Linten, Dimitri; Grasser, T. (2017)

Silicon microfluidics: an enabling technology for life sciences application

Majeed, Bivragh; Zhang, Lei; Fiorentino, Giuseppe; Verbinnen, Greet; Ashraf, Huma; Walsby, Edward; Roberts, Kerry; Al Kuzee, Jafar; Dawe, Rhys; Thomas, Dave; Sabuncuoglu Tezcan, Deniz (2017)

Conference contributions: Recent submissions

Test and design-for-test of 3D-stacked ICs ﻿

Testing of 2.5D- and 3D-stacked integrated circuits ﻿

3D IC stacking: Do-It-Yourself short course ﻿

Spin on metal oxide materials for N7 and beyond patterning applications ﻿

A bottom-up energy simulation framework to accurately compare PV module topologies under non-uniform and dynamic operating conditions ﻿

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration ﻿

Interconnected MTJs driven by STT for spin-logic applications ﻿

A perturbative approach to predict eye diagram degradation in differential interconnects subject to asymmetry and nonuniformity ﻿

Worst-case EMC investigation of single-wire transmission lines based on Taylor arithmetic ﻿

The impact of sequential-3D integration on semiconductor scaling roadmap ﻿

Design-technology co-optimization for OxRRAM-based synaptic processing unit ﻿

Photolithography as enabler of AMOLED displays beyond 1000 ppi ﻿

Monolithic near infrared image sensors enabled by quantum dot photodetector ﻿

SWIR detection with thin-film photodetectors based on colloidal quantum dots ﻿

Cavity wafer bonding after deep silicon etch ﻿

Low-power 1.3- $lm VCSEL transmitter for data center interconnects and beyond ﻿

Towards PaaS offering of BPMN 2.0 engines: A proposal for service-level tenant isolation ﻿

Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology ﻿

Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology ﻿

Silicon microfluidics: an enabling technology for life sciences application ﻿

Test and design-for-test of 3D-stacked ICs

Testing of 2.5D- and 3D-stacked integrated circuits

3D IC stacking: Do-It-Yourself short course

Spin on metal oxide materials for N7 and beyond patterning applications

A bottom-up energy simulation framework to accurately compare PV module topologies under non-uniform and dynamic operating conditions

Packaging silicon photonics with polymer waveguides for 3D electro-optical integration

Interconnected MTJs driven by STT for spin-logic applications

A perturbative approach to predict eye diagram degradation in differential interconnects subject to asymmetry and nonuniformity

Worst-case EMC investigation of single-wire transmission lines based on Taylor arithmetic

The impact of sequential-3D integration on semiconductor scaling roadmap

Design-technology co-optimization for OxRRAM-based synaptic processing unit

Photolithography as enabler of AMOLED displays beyond 1000 ppi

Monolithic near infrared image sensors enabled by quantum dot photodetector

SWIR detection with thin-film photodetectors based on colloidal quantum dots

Cavity wafer bonding after deep silicon etch

Low-power 1.3- $lm VCSEL transmitter for data center interconnects and beyond

Towards PaaS offering of BPMN 2.0 engines: A proposal for service-level tenant isolation

Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology

Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology

Silicon microfluidics: an enabling technology for life sciences application