Recently added

A capillary pump with a controllable filling pattern for lab-on-chip applications

Jones, Ben; Taher, Ahmed; Majeed, Bivragh; Fiorini, Paolo; Lagae, Liesbet; Peumans, Peter (2014)

Towards reduced impact of EUV mask defectivity on wafer

Jonckheere, Rik; Van Den Heuvel, Dieter; Pacco, Antoine; Pollentier, Ivan; Baudemprez, Bart; Jehoul, Christiane; Hermans, Jan; Hendrickx, Eric (2014-07)

MOCVD growth of highly-resistive carbon-doped GaN on 200 mm silicon

Jie, Su; Eric, Armour; Balakrishnan, Krishnan; Van Hove, Marleen; Saripalli, Yoga; Paranjpe, Ajit; Papasouliotis, George (2014)

Influence of trench width on III-V nucleation during InP selective area growth on patterned Si(001) substrates

Jiang, Sijia; Merckling, Clement; Moussa, Alain; Guo, Weiming; Waldron, Niamh; Collaert, Nadine; Barla, Kathy; Caymax, Matty; Vandervorst, Wilfried; Seefeldt, Marc; Heyns, Marc (2014)

Influence of trench width on III-V nucleation during InP selective area growth on pattern Si(001) substrate

Jiang, Sijia; Merckling, Clement; Guo, Weiming; Waldron, Niamh; Moussa, Alain; Caymax, Matty; Vandervorst, Wilfried; Seefeldt, Marc; Heyns, Marc (2014)

A single device based Voltage Step Stress (VSS) technique for fast reliability screening

Ji, Z.; Zhang, J. F.; Zhang, W. D.; Zhang, X.; Kaczer, Ben; De Gendt, Stefan; Groeseneken, Guido; Ren, P.; Wang, R.; Huang, R. (2014)

Fabrication and characterization of epitaxial Si-O superlattices

Jayachandran, Suseendran; Delabie, Annelies; Lin, Dennis; Douhard, Bastien; Richard, Olivier; Meersschaut, Johan; Moussa, Alain; Bender, Hugo; Caymax, Matty; Vandervorst, Wilfried; Heyns, Marc (2014)

Insight in bonding configuration of O atoms on Si(100) surface for epitaxial Si-O superlattices

Jayachandran, Suseendran; Delabie, Annelies; Douhard, Bastien; Conard, Thierry; Meersschaut, Johan; Bender, Hugo; Caymax, Matty; Vandervorst, Wilfried; Heyns, Marc (2014)

Optical power distributions through fractal routing

Jansen, Roelof; Claes, Tom; Neutens, Pieter; Du Bois, Bert; Helin, Philippe; Severi, Simone; Van Dorpe, Pol; Deshpande, Paru; Rottenberg, Xavier (2014)

Conformable, low level light therapy platform

Jablonski, Michal; Bossuyt, Frederick; Vanfleteren, Jan; Vervust, Thomas; De Smet, Herbert (2014)

The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses

Ivankovic, Andrej; Cherman, Vladimir; Gonzalez, Mario; Vandevelde, Bart; Vandepitte, Dirk; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2014)

Influence of high temperature on substrate effect of UTBB SOI nMOSFETs

Itocazu, Vitor T.; Sonneberg, Victor; Simoen, Eddy; Claeys, Cor; Martino, Joao A. (2014)

Inspection of directed self assembly defects

Ito, Chikashi; Durant, Stephane; Lange, Steve; Harukawa, Ryota; Miyagi, Takemasa; Nagaswami, Venkat; Rincon Delgadillo, Paulina; Gronheid, Roel; Nealey, Paul (2014)

Tunable inductance using transmission lines

Issakov, Vadim; Siprak, Domagoy; Koller, A.; Wambacq, Piet (2014)

Electroless Cu seed on Ru and Co liners in high aspect ratio TSV

Inoue, Fumihiro; Philipsen, Harold; Van Huylenbroeck, Stefaan; van der Veen, Marleen; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu (2014)

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Vandersmissen, Kevin; Van Huylenbroeck, Stefaan; Struyf, Herbert; Tanaka, Tetsu (2014)

Development of glyoxylic acid based electroless copper deposition on ruthenium

Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu; Shingubara, Shoso (2014)

Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner

Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu (2014)

A linear 28nm CMOS digital transmitter with 2x12bit up to LO baseband sampling and -58dBc C-IM3

Ingels, Mark; Zhang, Xiaoqiang; Raczkowski, Kuba; Cha, Sungwoo; Palmers, Pieter; Craninckx, Jan (2014-09)

A reliable method for the extraction of the lateral position of defects in ultra-scaled MOSFETs

Illarionov, Yu. Yu.; Bina, M.; Tyaginov, S. E.; Rott, K.; Reisinger, H.; Kaczer, Ben; Grasser, T. (2014)

Conference contributions: Recent submissions

A capillary pump with a controllable filling pattern for lab-on-chip applications ﻿

Towards reduced impact of EUV mask defectivity on wafer ﻿

MOCVD growth of highly-resistive carbon-doped GaN on 200 mm silicon ﻿

Influence of trench width on III-V nucleation during InP selective area growth on patterned Si(001) substrates ﻿

Influence of trench width on III-V nucleation during InP selective area growth on pattern Si(001) substrate ﻿

A single device based Voltage Step Stress (VSS) technique for fast reliability screening ﻿

Fabrication and characterization of epitaxial Si-O superlattices ﻿

Insight in bonding configuration of O atoms on Si(100) surface for epitaxial Si-O superlattices ﻿

Optical power distributions through fractal routing ﻿

Conformable, low level light therapy platform ﻿

The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses ﻿

Influence of high temperature on substrate effect of UTBB SOI nMOSFETs ﻿

Inspection of directed self assembly defects ﻿

Tunable inductance using transmission lines ﻿

Electroless Cu seed on Ru and Co liners in high aspect ratio TSV ﻿

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias ﻿

Development of glyoxylic acid based electroless copper deposition on ruthenium ﻿

Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner ﻿

A linear 28nm CMOS digital transmitter with 2x12bit up to LO baseband sampling and -58dBc C-IM3 ﻿

A reliable method for the extraction of the lateral position of defects in ultra-scaled MOSFETs ﻿