Recently added

Mid-infrared generation by frequency down-conversion across 1.2 octaves in a normally-dispersive silicon wire

Kuyken, Bart; Verheyen, Peter; Tannouri, P.; Van Campenhout, Joris; Baets, Roel; Roelkens, Gunther; Green, William M.J. (2013)

Application of atom probe tomography to epitaxial layers

Kumar, Arul; Gilbert, Matthieu; Kambham, Ajay Kumar; Gencarelli, Federica; Loo, Roger; Vandervorst, Wilfried (2013)

Optical features of free base meso-triarylcorroles

Kruk, M.; Knyukshto, V.; Fron, E.; Ngo, T.; Hofkens, J.; Savva, V.; Starukhin, A.; Maes, Wouter; Dehaen, W. (2013)

Silicon-organic hybrid (SOH) IQ modulator for 16QAM at 112 Gbit/s

Korn, D.; Palmer, R.; Hu, H.; Schindler, P.C.; Alloatti, L.; Baier, M.; Schmogrow, R.; Bogaerts, Wim; Selvaraja, Shankar; Lepage, Guy; Pantouvaki, M.; Wauters, Peter; Verheyen, Peter; Van Campenhout, Joris; Absil, Philippe; Baets, Roel; Dinu, R.; Koos, C.; Freude, W.; Leuthold, J. (2013)

Reliable and energy-efficient 21MHz 0.4V dynamically reconfigurable SoC for ExG applications in 40nm LP CMOS

Konijnenburg, Mario; Cho, Y.; Ashouei, Maryam; Gemmeke, Tobias; Kim, C.; Hulzink, Jos; Stuijt, Jan; Jung, M.; Huisken, Jos; Ryu, S.; Kim, J.; de Groot, Harmke (2013)

Adhesion test for UTCP structure in humid environment

Kokko, Kati; Sterken, Tom; Vermeiren, Filip; Vanfleteren, Jan (2013)

Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion

Kirimura, Tomoyuki; Croes, Kristof; Siew, Yong Kong; Vanstreels, Kris; Czarnecki, Piotr; El-Mekki, Zaid; van der Veen, Marleen; Dictus, Dries; Yoon, A.; Kolics, A.; Boemmels, Juergen; Tokei, Zsolt (2013)

Characterization of metal permeation in porous low-k films by spectroscopic ellipsometry

Kim, Tae-Gon; Verdonck, Patrick; Ciofi, Ivan; Barbarin, Yohan; Tokei, Zsolt; Baklanov, Mikhaïl (2013)

A 20μW intra-cardiac signal-processing IC with 82dB bio-impedance measurement dynamic range and analog feature extraction for ventricular fibrillation detection

Kim, Sunyoung; Yan, Long; Mitra, Srinjoy; Osawa, Masato; Harada, Yasunari; Tamiya, Kosei; Van Hoof, Chris; Yazicioglu, Refet Firat (2013)

Self-aligned double patterning of 1x nm FinFETs; a new device integration through the challenging geometry

Kim, Min-Soo; Vandeweyer, Tom; Altamirano Sanchez, Efrain; Dekkers, Harold; Van Besien, Els; Tsvetanova, Diana; Richard, Olivier; Chew, Soon Aik; Boccardi, Guillaume; Horiguchi, Naoto (2013)

Bulk FinFET Fin height control using Gas Cluster Ion Beam (GCIB) - Location Specific Processing (LSP)

Kim, Min-Soo; Ritzenthaler, Romain; Everaert, Jean-Luc; Fernandez, Luis; Devriendt, Katia; Lee, Jae Woo; Redolfi, Augusto; Mertens, Sofie; Burke, Ed; Horiguchi, Naoto; Thean, Aaron (2013)

FinFET: Towards a new horizon

Kim, Min-Soo (2013)

Impact of partial resistive defects and bias temperature instability on SRAM decoder reliability

Khan, Seyab; Taouil, Mottaqiallah; Hamdioui, Said; Kukner, Halil; Raghavan, Praveen; Catthoor, Francky (2013)

Bias temperature instability analysis in SRAM decoder

Khan, Seyab; Hamdioui, Said; Kukner, Halil; Raghavan, Praveen; Catthoor, Francky (2013)

60GHz transmitter front-end in 40nm LP-CMOS with improved back-off efficiency

Khalaf, Khaled; Vidojkovic, Vojkan; Vaesen, Kristof; Parvais, Bertrand; Long, John R.; Wambacq, Piet (2013)

Heterogenously integrated III-V/Si lasers based on DVS-BCB bonding

Keyvaninia, Shahram; Verstuyft, Steven; Van Landschoot, Liesbet; Lelarge, F.; Duan, G.H.; Lamponi, M.; Messaoudene, S.; Fedeli, J.M.; de Vries, T.; Smalbrugge, B.; Geluk, E.J.; Bolk, J.; Smit, M.; Baets, Roel; Van Thourhout, Dries; Roelkens, Gunther (2013)

Conference contributions: Recent submissions

Mid-infrared generation by frequency down-conversion across 1.2 octaves in a normally-dispersive silicon wire

Application of atom probe tomography to epitaxial layers

Optical features of free base meso-triarylcorroles

Silicon-organic hybrid (SOH) IQ modulator for 16QAM at 112 Gbit/s

Reliable and energy-efficient 21MHz 0.4V dynamically reconfigurable SoC for ExG applications in 40nm LP CMOS

Adhesion test for UTCP structure in humid environment

Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion

Characterization of metal permeation in porous low-k films by spectroscopic ellipsometry

A 20μW intra-cardiac signal-processing IC with 82dB bio-impedance measurement dynamic range and analog feature extraction for ventricular fibrillation detection

Self-aligned double patterning of 1x nm FinFETs; a new device integration through the challenging geometry

Bulk FinFET Fin height control using Gas Cluster Ion Beam (GCIB) - Location Specific Processing (LSP)

FinFET: Towards a new horizon

Impact of partial resistive defects and bias temperature instability on SRAM decoder reliability

Bias temperature instability analysis in SRAM decoder

60GHz transmitter front-end in 40nm LP-CMOS with improved back-off efficiency

Heterogenously integrated III-V/Si lasers based on DVS-BCB bonding

III-V/silicon first order distributed feedback lasers integrated on SOI waveguide circuits

Heterogeneously integrated III-V/Si single mode lasers based on a MMI-ring configuration triplet-ring reflectors

Demonstration of a novel III-V-on-Si distributed feedback laser

DVS-BCB adhesive bonding for silicon photonics

Conference contributions: Recent submissions

Mid-infrared generation by frequency down-conversion across 1.2 octaves in a normally-dispersive silicon wire ﻿

Application of atom probe tomography to epitaxial layers ﻿

Optical features of free base meso-triarylcorroles ﻿

Silicon-organic hybrid (SOH) IQ modulator for 16QAM at 112 Gbit/s ﻿

Reliable and energy-efficient 21MHz 0.4V dynamically reconfigurable SoC for ExG applications in 40nm LP CMOS ﻿

Adhesion test for UTCP structure in humid environment ﻿

Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion ﻿

Characterization of metal permeation in porous low-k films by spectroscopic ellipsometry ﻿

A 20μW intra-cardiac signal-processing IC with 82dB bio-impedance measurement dynamic range and analog feature extraction for ventricular fibrillation detection ﻿

Self-aligned double patterning of 1x nm FinFETs; a new device integration through the challenging geometry ﻿

Bulk FinFET Fin height control using Gas Cluster Ion Beam (GCIB) - Location Specific Processing (LSP) ﻿

FinFET: Towards a new horizon ﻿

Impact of partial resistive defects and bias temperature instability on SRAM decoder reliability ﻿

Bias temperature instability analysis in SRAM decoder ﻿

60GHz transmitter front-end in 40nm LP-CMOS with improved back-off efficiency ﻿

Heterogenously integrated III-V/Si lasers based on DVS-BCB bonding ﻿

III-V/silicon first order distributed feedback lasers integrated on SOI waveguide circuits ﻿

Heterogeneously integrated III-V/Si single mode lasers based on a MMI-ring configuration triplet-ring reflectors ﻿

Demonstration of a novel III-V-on-Si distributed feedback laser ﻿

DVS-BCB adhesive bonding for silicon photonics ﻿

Mid-infrared generation by frequency down-conversion across 1.2 octaves in a normally-dispersive silicon wire

Application of atom probe tomography to epitaxial layers

Optical features of free base meso-triarylcorroles

Silicon-organic hybrid (SOH) IQ modulator for 16QAM at 112 Gbit/s

Reliable and energy-efficient 21MHz 0.4V dynamically reconfigurable SoC for ExG applications in 40nm LP CMOS

Adhesion test for UTCP structure in humid environment

Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion

Characterization of metal permeation in porous low-k films by spectroscopic ellipsometry

A 20μW intra-cardiac signal-processing IC with 82dB bio-impedance measurement dynamic range and analog feature extraction for ventricular fibrillation detection

Self-aligned double patterning of 1x nm FinFETs; a new device integration through the challenging geometry

Bulk FinFET Fin height control using Gas Cluster Ion Beam (GCIB) - Location Specific Processing (LSP)

FinFET: Towards a new horizon

Impact of partial resistive defects and bias temperature instability on SRAM decoder reliability

Bias temperature instability analysis in SRAM decoder

60GHz transmitter front-end in 40nm LP-CMOS with improved back-off efficiency

Heterogenously integrated III-V/Si lasers based on DVS-BCB bonding

III-V/silicon first order distributed feedback lasers integrated on SOI waveguide circuits

Heterogeneously integrated III-V/Si single mode lasers based on a MMI-ring configuration triplet-ring reflectors

Demonstration of a novel III-V-on-Si distributed feedback laser

DVS-BCB adhesive bonding for silicon photonics