Recently added

Multi-band simultaneous radio frequency energy harvesting

Keyrouz, Shady; Visser, Huib; Tijhuis, A.G. (2013)

Efficient direct matching rectenna design for RF power transfer applications

Keyrouz, Shady; Visser, Huib (2013)

Imidazolium-substituted polythiophenes as different electron transport materials improving photovoltaic performance

Kesters, Jurgen; Ghoos, Toon; Drijkoningen, Jeroen; Vangerven, Tim; Lutsen, Laurence; Vanderzande, Dirk; Manca, Jean; Maes, Wouter (2013)

Wet removal of post-etch residues by a combination of UV irradiation and a SC1 process

Kesters, Els; Le, Quoc Toan; Simms, Ihsan; Nafus, Kathleen; Struyf, Herbert; De Gendt, Stefan (2013)

Integration of wet cleaning in 45 nm pitch BEOL processing

Kesters, Els; Le, Quoc Toan; Lazzarino, Frederic; Decoster, Stefan; Wilson, Chris; Holsteyns, Frank; De Gendt, Stefan (2013)

TFT technologies on foil

Ke, Tung Huei; Steudel, Soeren (2013)

Fully integrated organic CMOS circuits on PEN-foil

Ke, Tung Huei; Muller, Robert; Kam, Benjamin; Rockele, Maarten; Vaisman Chasin, Adrian; Myny, Kris; Steudel, Soeren; Abdinia, Sahel; Cantatore, Eugenio; Genoe, Jan; van der Putten, Bas; Heremans, Paul (2013)

Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic component

Kaur, Kamalpreet; Missinne, Jeroen; Vandecasteele, Bjorn; Van Steenberge, Geert; Perinchery, S.M.; Smits, E.C.P.; Mandamparabil, R. (2013)

Reliability of MOL local interconnects

Kauerauf, Thomas; Branka, Anna; Sorrentino, Beppo; Roussel, Philippe; Demuynck, Steven; Croes, Kristof; Mercha, Abdelkarim; Boemmels, Juergen; Tokei, Zsolt; Groeseneken, Guido (2013)

Effect of TSV presence on FEOL yield and reliability

Kauerauf, Thomas; Branka, Anna; Croes, Kristof; Redolfi, Augusto; Civale, Yann; Torregiani, Cristina; Groeseneken, Guido; Beyne, Eric (2013)

Reliability and performance considerations for NMOSFET pass gates in FPGA applications

Kaczer, Ben; Chen, Chris; Watt, Jeff; Chanda, Kaushik; Weckx, Pieter; Toledano Luque, Maria; Groeseneken, Guido; Grasser, Tibor (2013)

Experimental characterization of BTI defects

Kaczer, Ben; Afanasiev, Valeri; Rott, Karina; Cerbu, F.; Franco, Jacopo; Grasser, Tibor; Madia, O.; Nguyen, A. P. D.; Stesmans, Andre; Resinger, Hans; Toledano Luque, Maria; Weckx, Pieter (2013)

CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies

Jourdan, Nicolas; Machillot, Jerome; Barbarin, Yohan; Siew, Yong Kong; Ai, Hua; Cockburn, Andrew; Nguyen, Mai Phuong; Van Elshocht, Sven; Boemmels, Juergen; Lakshmanan, A.; Ma, Paul; Narasimhan, Murali; Tokei, Zsolt (2013)

Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications

Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Murdoch, Gayle; Miller, Andy; Rebibis, Kenneth June; Guerrero, Alice; McCutcheon, Jeremy; Privett, Mark; Neidrich, Jason; Beyer, Gerald; Beyne, Eric (2013)

A single step method for characterizing blue phase LCs at various temperatures

Joshi, Pankaj; De Smet, Jelle; Shang, Xiaobing; Cuypers, Dieter; Van Steenberge, Geert; Van Vlierberghe, Sandra; Dubruel, Peter; De Smet, Herbert (2013)

A year of new mask defectivity insights in imec's EUVL program

Jonckheere, Rik; Van Den Heuvel, Dieter; Baudemprez, Bart; Jehoul, Christiane; Pacco, Antoine (2013)

Negative bias temperature instability lifetime prediction: problems and solutions

Ji, Z.; Hatta, S. F. W. M.; Zhang, J. F.; Ma, G. M.; Zhang, W.; Soin, N.; Kaczer, Ben; De Gendt, Stefan; Groeseneken, Guido (2013)

Monolithic integration of flexible spectral filters with CMOS image sensors at wafer level for low cost hyperspectral imaging

Jayapala, Murali; Lambrechts, Andy; Tack, Klaas; Geelen, Bert; Masschelein, Bart; Soussan, Philippe (2013)

STI and eSiGe source/drain stressors induced stress modeling in 28 nm technology with replacement gate (RMG) process

Jang, Doyoung; Garcia Bardon, Marie; Yakimets, Dmitry; Miyaguchi, Kenichi; De Keersgieter, An; Chiarella, Thomas; Ritzenthaler, Romain; Dehan, Morin; Mercha, Abdelkarim (2013)

Microbump lithography for 3D stacking applications

Jaenen, Patrick; Slabbekoorn, John; Miller, Andy; Flack, Warren W.; Ranjan, Manish; Kenyon, Gareth; Hsieh, Robert; Nguyen, Ha-Ai (2013)

Conference contributions: Recent submissions

Multi-band simultaneous radio frequency energy harvesting ﻿

Efficient direct matching rectenna design for RF power transfer applications ﻿

Imidazolium-substituted polythiophenes as different electron transport materials improving photovoltaic performance ﻿

Wet removal of post-etch residues by a combination of UV irradiation and a SC1 process ﻿

Integration of wet cleaning in 45 nm pitch BEOL processing ﻿

TFT technologies on foil ﻿

Fully integrated organic CMOS circuits on PEN-foil ﻿

Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic component ﻿

Reliability of MOL local interconnects ﻿

Effect of TSV presence on FEOL yield and reliability ﻿

Reliability and performance considerations for NMOSFET pass gates in FPGA applications ﻿

Experimental characterization of BTI defects ﻿

CVD-Mn(Nx) as copper diffusion barrier for advanced interconnect technologies ﻿

Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications ﻿

A single step method for characterizing blue phase LCs at various temperatures ﻿

A year of new mask defectivity insights in imec's EUVL program ﻿

Negative bias temperature instability lifetime prediction: problems and solutions ﻿

Monolithic integration of flexible spectral filters with CMOS image sensors at wafer level for low cost hyperspectral imaging ﻿

STI and eSiGe source/drain stressors induced stress modeling in 28 nm technology with replacement gate (RMG) process ﻿

Microbump lithography for 3D stacking applications ﻿