Recently added

High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Sterken, Tom; Op de Beeck, Maaike; Vermeiren, Filip; Torfs, Tom; Wang, Liang; Priyabadini, Swarnakamal; Dhaenens, Kristof; Cuypers, Dieter; Vanfleteren, Jan (2012)

Embedded UTCP interposers for miniature smart sensors

Sterken, Tom; Op de Beeck, Maaike; Torfs, Tom; Vermeiren, Filip; Van Hoof, Chris; Vanfleteren, Jan (2012)

Modeling electroporation on micro-electrode arrays

Stassen, Andim; Huys, Roeland; Lagae, Liesbet; Braeken, Dries (2012)

Modular sub-wavelength diffractive light modulator for high-definition holographic displays

Stahl, Richard; Rochus, Veronique; Rottenberg, Xavier; Cosemans, Stefan; Haspeslagh, Luc; Severi, Simone; Van der Plas, Geert; Lafruit, Gauthier; Donnay, Stephane (2012)

2kV breakdown voltage GaN-on-Si DHFETs with sub-micron thick AlGaN Buffer

Srivastava, Puneet; Cheng, Kai; Das, Jo; Van Hove, Marleen; Leys, Maarten; Marcon, Denis; Visalli, Domenica; Geens, Karen; Decoutere, Stefaan; Mertens, Robert; Borghs, Gustaaf (2012)

SNR estimation and interference mitigation techniques for non-coherent detection of OOK signals

Sridharan, Venkat; Kiyani, Nauman; Nikookar, H. (2012)

Novel methodology to integrate ultra-thin chips on flexible foils

Sridhar, Ashok; Cauwe, Maarten; Kusters, Roel; Fledderus, H; van den Brand, Jeroen (2012)

Novel interconnect methodologies for ultra-thin chips on foils

Sridhar, A.; Cauwe, Maarten; Fledderus, H.; Kusters, R.; van den Brand, Jeroen (2012)

Efficient vertical coupling between a silicon waveguide and an InP-based microdisk

Spuesens, Thijs; De Koninck, Yannick; Van Thourhout, Dries (2012)

15nm HP patterning with EUV lithography and SADP

Souriau, Laurent; Hellin, David; Kunnen, Eddy; Versluijs, Janko; Dekkers, Harold; Albert, Johan; Orain, Isabelle; Yoshie, Kimura; Xu, Kaidong; Vertommen, Johan; Wiaux, Vincent; Boullart, Werner (2012)

Performance of 80 Gb/s MMI-based DQPSK demodulator on SOI

Sotiropoulos, N.; de Waardt, H.; Koonen, A.M.J.; Vermeulen, Diedrik; Roelkens, Gunther; Halir, R.; Wanguemert-perez, G. (2012)

Low-field mobility in ultrathin silicon nanowire junctionless transistors

Soree, Bart; Magnus, Wim; Vandenberghe, William (2012)

Comparison of directed self-assembly integrations

Somervell, Mark; Gronheid, Roel; Hooge, Joshua; Nafus, Kathleen; Rincon Delgadillo, Paulina; Thode, Chris; Younkin, Todd; Matsunaga, Koichi; Rathsack, Ben; Scheer, Steven; Nealy, Paul (2012)

Test strategies for wide-I/O memory, 3D-TSV technology test vehicles and ultra-fine-pitch applications

Smith, Ken; Bock, Daniel; Gleeson, Read; Jolley, Mike; Marinissen, Erik Jan (2012-11)

Verification of back-to-front-side alignment for advanced packaging

Slabbekoorn, John; Miller, Andy (2012)

Passivation challenges with Ge and III/V devices

Sioncke, Sonja; Lin, Dennis; Nyns, Laura; Delabie, Annelies; Thean, Aaron; Horiguchi, Naoto; Struyf, Herbert; De Gendt, Stefan; Caymax, Matty (2012)

Deep-level transient spectroscopy of MOS capacitors on GeSn epitaxial layers

Simoen, Eddy; Vincent, Benjamin; Merckling, Clement; Gencarelli, Federica; Chu, L-K; Loo, Roger (2012)

Insights in low frequency noise of advanced and high-mobility channel transistors

Simoen, Eddy; Romeo, Tomasso; Luque Rodriguez, Abraham; Jimenez Tejada, Juan Antonio; Aoulaiche, Marc; Veloso, Anabela; Jurczak, Gosia; Mitard, Jerome; Caillat, Christian; Fazan, Pierre; Crupi, Felice; Claeys, Cor (2012)

On the correlation between the retention time of FBRAM and the low-frequency noise of UTBOX SOI nMOSFETs

Simoen, Eddy; Aoulaiche, Marc; Veloso, Anabela; Jurczak, Gosia; Claeys, Cor; Mendes Almeida, Luciano; Andrada, Gloria; Luque Rodrigues, Abraham; Jimenez Tejada, Juan Antonio; Caillat, Christian; Fazan, Pierre (2012)

On the variability of the low-frequency noise in UTBOX SOI nMOSFETs

Simoen, Eddy; Andrade, G.M.C.; Mendes Almeida, Luciano; Aoulaiche, Marc; Caillat, Christian; Jurczak, Gosia; Claeys, Cor (2012)

Conference contributions: Recent submissions

High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP) ﻿

Embedded UTCP interposers for miniature smart sensors ﻿

Modeling electroporation on micro-electrode arrays ﻿

Modular sub-wavelength diffractive light modulator for high-definition holographic displays ﻿

2kV breakdown voltage GaN-on-Si DHFETs with sub-micron thick AlGaN Buffer ﻿

SNR estimation and interference mitigation techniques for non-coherent detection of OOK signals ﻿

Novel methodology to integrate ultra-thin chips on flexible foils ﻿

Novel interconnect methodologies for ultra-thin chips on foils ﻿

Efficient vertical coupling between a silicon waveguide and an InP-based microdisk ﻿

15nm HP patterning with EUV lithography and SADP ﻿

Performance of 80 Gb/s MMI-based DQPSK demodulator on SOI ﻿

Low-field mobility in ultrathin silicon nanowire junctionless transistors ﻿

Comparison of directed self-assembly integrations ﻿

Test strategies for wide-I/O memory, 3D-TSV technology test vehicles and ultra-fine-pitch applications ﻿

Verification of back-to-front-side alignment for advanced packaging ﻿

Passivation challenges with Ge and III/V devices ﻿

Deep-level transient spectroscopy of MOS capacitors on GeSn epitaxial layers ﻿

Insights in low frequency noise of advanced and high-mobility channel transistors ﻿

On the correlation between the retention time of FBRAM and the low-frequency noise of UTBOX SOI nMOSFETs ﻿

On the variability of the low-frequency noise in UTBOX SOI nMOSFETs ﻿