Recently added

Formation of fluorocarbon polymer and its removal in back-end-of-line processing of advanced CMOS integrated circuits

Le, Quoc Toan; Vereecke, Guy; Kesters, Els; Struyf, Herbert; De Gendt, Stefan (2012-11)

UV-induced modification of fluorocarbon polymer for improvement of wet removal

Le, Quoc Toan; Simms, Ihsan; Yue, Henry; Brown, Ian; Kesters, Els; Struyf, Herbert; De Gendt, Stefan (2012)

Etch challenges of a spin-on trilayer resist system for narrow pitch dual damascene patterning

Lazzarino, Frederic; Wilson, Chris; Truffert, Vincent; Vereecke, Bart; Demuynck, Steven; de Marneffe, Jean-Francois; Baklanov, Mikhaïl (2012)

Providing "Insite" in the unknown design space

Lauwereins, Rudy (2012)

Biomedical electronics serving as physical, environmental, and emotional watchdogs?

Lauwereins, Rudy (2012)

Mix and match overlay optimization for advanced lithography tools (193i and EUV)

Laidler, David; D'have, Koen; Hermans, Jan; Cheng, Shaunee (2012)

Energy-efficient colourless photonic technologies for next-generation DWDM metro and access networks

Lai, C.P.; Naughton, A.; Ossieur, P.; Townsend, P.D.; Smith, D.W.; Borghesani, A.; Moodie, D.G.; Maxwell, G.; Bauwelinck, Johan; Vaernewyck, Renato; Verbrugghe, Jochen; Yin, Xin; Qiu, Xing Zhi; Eiselt, M.; Grobe, K.; Parsons, N.; Jensen, R.; Kehayas, E. (2012)

Merging electronic and fluidic functionality for building cellular and biomolecular interfacing tools

Lagae, Liesbet (2012)

3D stacking using ultra thin dies

La Manna, Antonio; Velenis, Dimitrios; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Zhang, Wenqi; Beyne, Eric (2012)

Small pitch micro-bumping and experimental investigation for under filling 3D stacking

La Manna, Antonio; Rebibis, Kenneth June; De Vos, Joeri; Bogaerts, Lieve; Gerets, Carine; Beyne, Eric (2012-09)

Process development to enable die sorting and 3D IC stacking

La Manna, Antonio; Daily, Robert; Capuz, Giovanni; Rebibis, Kenneth June; Bogaerts, Lieve; Miller, Andy; Beyne, Eric (2012-12)

Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices

La Manna, Antonio; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Velenis, Dimitrios; Zhang, Wenqi; Beyne, Eric (2012-06)

Contact edge roughness and CD uniformity in EUV: effect of photo acid generator and sensitizer

Kuppuswamy, Vijaya-Kumar Murugesan; Constantoudis, Vassilios; Gogolides, Evangelos; Vaglio Pret, Alessandro; Gronheid, Roel (2012)

Influence and evolution of 193i resist composition during VUV exposure

Kunnen, Eddy; Vaglio Pret, Alessandro; Verdonck, Patrick; Gronheid, Roel (2012)

Interaction between Netrin-1 gradient and surface topography for axon guidance in hippocampal neurons

Kundu, Arnab; Micholt, Liesbeth; Rand, Danielle; Eberle, Wolfgang; Bartic, Carmen; Dotti, Carlos; Levchenko, Andre; Braeken, Dries (2012)

Non-reciprocal response in heterogeneously integrated microdisks

Kumar, Rajesh; Morthier, Geert (2012)

10Gbit/s bias-free and error-free all-optical NRZ-OOK to RZ-OOK format conversion using a III-V-on-silicon microdisk resonator

Kumar, Rajesh; Spuesens, Thijs; Mechet, Pauline; Olivier, Nicolas; Fedeli, Jean-Marc; Regreny, Philippe; Roelkens, Gunther; Van Thourhout, Dries; Morthier, Geert (2012)

Atomic insight into relaxation mechanism of Ge(1-x)Sn(x) using atom probe tomography

Kumar, Arul; Kambham, Ajay Kumar; Gilbert, Matthieu; Vandervorst, Wilfried (2012)

Atomic insight of Ge(1-x)Sn(x) using atom probe tomography

Kumar, Arul; Gencarelli, Federica; Vincent, Benjamin; Kambham, Ajay Kumar; Gilbert, Matthieu; Vandervorst, Wilfried (2012)

Impact of duty factor, stress stimuli, and gate drive strength on gate delay degradation with an atomistic trap-based BTI model

Kukner, Halil; Weckx, Pieter; Raghavan, Praveen; Kaczer, Ben; Catthoor, Francky; Van der Perre, Liesbet; Lauwereins, Rudy; Groeseneken, Guido (2012)

Conference contributions: Recent submissions

Formation of fluorocarbon polymer and its removal in back-end-of-line processing of advanced CMOS integrated circuits ﻿

UV-induced modification of fluorocarbon polymer for improvement of wet removal ﻿

Etch challenges of a spin-on trilayer resist system for narrow pitch dual damascene patterning ﻿

Providing "Insite" in the unknown design space ﻿

Biomedical electronics serving as physical, environmental, and emotional watchdogs? ﻿

Mix and match overlay optimization for advanced lithography tools (193i and EUV) ﻿

Energy-efficient colourless photonic technologies for next-generation DWDM metro and access networks ﻿

Merging electronic and fluidic functionality for building cellular and biomolecular interfacing tools ﻿

3D stacking using ultra thin dies ﻿

Small pitch micro-bumping and experimental investigation for under filling 3D stacking ﻿

Process development to enable die sorting and 3D IC stacking ﻿

Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices ﻿

Contact edge roughness and CD uniformity in EUV: effect of photo acid generator and sensitizer ﻿

Influence and evolution of 193i resist composition during VUV exposure ﻿

Interaction between Netrin-1 gradient and surface topography for axon guidance in hippocampal neurons ﻿

Non-reciprocal response in heterogeneously integrated microdisks ﻿

10Gbit/s bias-free and error-free all-optical NRZ-OOK to RZ-OOK format conversion using a III-V-on-silicon microdisk resonator ﻿

Atomic insight into relaxation mechanism of Ge(1-x)Sn(x) using atom probe tomography ﻿

Atomic insight of Ge(1-x)Sn(x) using atom probe tomography ﻿

Impact of duty factor, stress stimuli, and gate drive strength on gate delay degradation with an atomistic trap-based BTI model ﻿