Browsing Articles by imec author "ffa6b56a8cf126ab49587f774ffc806dd452bad6"
Now showing items 1-16 of 16
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Assessment of STI dry etch process variability by means of dynamic time warping technique
Milenin, Alexey; Chan, BT; Lazzarino, Frederic (2023) -
Buried power rail integration with FinFETs for ultimate CMOS scaling
Gupta, Anshul; Varela Pedreira, Olalla; Arutchelvan, Goutham; Zahedmanesh, Houman; Devriendt, Katia; Hanssen, Frederik; Tao, Zheng; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, Noemie; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min-Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Cousserier, Joris; Yakimets, Dmitry; Lazzarino, Frederic; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Jaysankar, Manoj; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Boemmels, Juergen; Demuynck, Steven; Tokei, Zsolt; Horiguchi, Naoto (2020) -
Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm node
Bekaert, Joost; Van Look, Lieve; Truffert, Vincent; Lazzarino, Frederic; Vandenberghe, Geert; Reybrouck, Mario; Tarutani, Shinji (2010-12) -
Direct metal etch for advanced interconnect
Paolillo, Sara; Wan, Danny; Lazzarino, Frederic; Rassoul, Nouredine; Piumi, Daniele; Tokei, Zsolt (2018) -
Evolution of lithography-to-etch bias in multi-patterning processes
Panneerchelvam, Prem; Agarwal, Ankur; Huard, Chad M. M.; Pret, Alessandro Vaglio; Mani, Antonio; Gronheid, Roel; Demand, Marc; Kumar, Kaushik; Paolillo, Sara; Lazzarino, Frederic (2022) -
Experimental verification of source-mask optimization and freeform illumination for 22 nm node SRAM cells
Bekaert, Joost; Laenens, Bart; Verhaegen, Staf; Van Look, Lieve; Trivkovic, Darko; Lazzarino, Frederic; Vandenberghe, Geert; Van Adrichem, Paul; Socha, Robert; Hsu, Stephen; Liu, Hua Yu; Mouraille, Orion; Schreel, Koen; Dusa, Mircea; Zimmermann, Joerg; Gräupner, Paul; Neumann, Jens Timo (2011-03) -
Extreme contact shrink for back end of line connectivity
Schleicher, Filip; Paolillo, Sara; Decoster, Stefan; Wu, Chen; Vega Gonzalez, Victor; Hasan, Mahmudul; Beral, Christophe; Lazzarino, Frederic (2022-05-10) -
Fabrication and room temperature characterization of trilayer junctions for the development of superconducting qubits on 300 mm wafers
Wan, Danny; Couet, Sebastien; Piao, Xiaoyu; Souriau, Laurent; Canvel, Yann; Tsvetanova, Diana; Vangoidsenhoven, Diziana; Thiam, Arame; Pacco, Antoine; Potocnik, Anton; Mongillo, Massimo; Ivanov, Tsvetan; Jussot, Julien; Verjauw, Jeroen; Acharya, Rohith; Lazzarino, Frederic; Govoreanu, Bogdan; Radu, Iuliana (2021) -
High-Density Nanopatterning of SiGeAsTe Chalcogenide as Ovonic Threshold Switch Selectors for Memory Applications
Kundu, Shreya; Garbin, Daniele; Devulder, Wouter; Donadio, Gabriele Luca; Lazzarino, Frederic (2023) -
High-Density Patterning of InGaZnO by CH4: a Comparative Study of RIE and Pulsed Plasma ALE
Kundu, Shreya; Decoster, Stefan; Bezard, Philippe; Nalin Mehta, Ankit; Dekkers, Harold; Lazzarino, Frederic (2022-07-19) -
Metal containing resist readiness for HVM EUV lithography
De Simone, Danilo; Mao, Ming; Lazzarino, Frederic; Vandenberghe, Geert (2016) -
Modeling the topography of uneven substrates post spin-coating
Decoster, Stefan; Xiaoyu, Piao; Gillijns, Werner; Lazzarino, Frederic (2018) -
Modification of PECVD and SOG ultralow-k films by CO2 plasma
Olawumi, Teju Tunde; Levrau, E.; Krishtab, Mikhail; Detavernier, C.; Bartha, J.W.; Lazzarino, Frederic; Baklanov, Mikhaïl (2015) -
Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below
Decoster, Stefan; Camerotto, Elisabeth; Murdoch, Gayle; Kundu, Souvik; Jurczak, Gosia; Le, Quoc Toan; Tokei, Zsolt; Lazzarino, Frederic (2022-04-26) -
Patterning of 25nm contact holes at 90nm pitch: combination of line/space double exposure immersion lithography and plasma-assisted shrink technology
de Marneffe, Jean-Francois; Lazzarino, Frederic; Goossens, Danny; Vandervorst, Alain; Richard, Olivier; Shamiryan, Denis; Xu, Kaidong; Truffert, Vincent; Boullart, Werner (2011) -
Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes
Kumaresan, Vishnuvarthan; Wilson, Chris; Verdonck, Patrick; Van Besien, Els; Lazzarino, Frederic; Truffert, Vincent; Boemmels, Juergen; Tokei, Zsolt; Wong, T.K.S. (2014)