Browsing Presentations by imec author "1a00bb760e20c5ca0608491087a61c9d19f6d8e8"
Now showing items 1-16 of 16
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Application of immersion lithography inside the MEDEA+ LIQUID project
Massin, Jean; Kupers, Michiel; Thony, Philippe; Postnikov, Sergei; Ercken, Monique; Morton, Rob (2005) -
Challenges in setting up the patterning processes for a 16nm node SRAM cell
Ercken, Monique; Vandeweyer, Tom; Versluijs, Janko; Truffert, Vincent; De Backer, Johan; Delvaux, Christie; Baerts, Christina (2010) -
Determining the impact of statistical fluctuations on resist line edge roughness
Leunissen, Peter; Ercken, Monique; Patsis, George P. (2004) -
Double patterning: from split to process control
Wiaux, Vincent; Ercken, Monique; Maenhoudt, Mireille; Cheng, Shaunee (2007) -
Doubling or quadrupling MuGFET Fin integration scheme with higher pattern fidelity, lower CD variation and higher layout efficiency
Rooyackers, Rita; Augendre, Emmanuel; Degroote, Bart; Collaert, Nadine; Nackaerts, Axel; Dixit, Abhisek; Vandeweyer, Tom; Pawlak, Bartek; Ercken, Monique; Kunnen, Eddy; Dilliway, Gabriela; Leys, Frederik; Loo, Roger; Jurczak, Gosia; Biesemans, Serge (2007) -
Dry-etch Fin patterning on SOI: transition from 32 to 22nm node on a 6T-SRAM cell
Altamirano Sanchez, Efrain; Ercken, Monique; Veloso, Anabela; Demand, Marc; Boullart, Werner (2009) -
Integration challenges of spin torque majority gatelogic
Wilson, Chris; Manfrini, Mauricio; Thiam, Arame; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Vaysset, Adrien; Trivkovic, Darko; Ercken, Monique; Swerts, Johan; Briggs, Basoene; Sayan, Safak; Radu, Iuliana; Mocuta, Dan (2016) -
Interim investigation of CD-SEM resist shrinkage in 193nm lithography
Hoffmann, Thomas; Storms, Greet; Vandenbroeck, Nadia; Delvaux, Christie; Ercken, Monique; Pollentier, Ivan; Ronse, Kurt; Takuji, Tada; Felten, Frank; Wong, Evelyn (2002) -
Line edge roughness and its increasing importance
Ercken, Monique; Storms, Greet; Delvaux, Christie; Vandenbroeck, Nadia; Leunissen, Peter; Pollentier, Ivan (2002) -
Line edge roughness: experimental results related to a two-parameter model
Leunissen, Peter; Lawrence, W.G.; Ercken, Monique (2003) -
Lithography options for the 32nm half pitch node
Gronheid, Roel; Ercken, Monique; Ronse, Kurt (2007) -
Metrology method for the correlation of line edge roughness for different resists before and after etch
Winkelmeier, Stephanie; Sarstedt, Margit; Ercken, Monique; Goethals, Mieke; Ronse, Kurt (2000) -
New lithographic requirements for the implant levels in scaled devices
Vandeweyer, Tom; Baerts, Christina; Horiguchi, Naoto; Ercken, Monique (2010) -
Opportunities and challenges in immersion lithography
Maenhoudt, Mireille; Vandenberghe, Geert; Ercken, Monique; Cheng, Shaunee; Leunissen, Peter; Ronse, Kurt (2005) -
Optimization of an advanced positive DUV photoresist towards 150 nm and beyond
Ercken, Monique; Moelants, Myriam; Vandenberghe, Geert; Goethals, Mieke; Ronse, Kurt; Masuda, Seiya; Spiess, Walter; Pawlowski, G. (1999) -
Optimization of an advanced positive DUV resist for 248 nm L/S pattern printing
Ercken, Monique; Pollers, Ingrid; Van Puyenbroeck, Ilse; Goethals, Mieke; Ronse, Kurt; Pawlowski, G.; Spiess, Walter (1998)