Browsing by Author "Baelmans, Martine"
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Publication 3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.2383-2390Publication 3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
Proceedings paper2015, 31st Semiconductor Thermal Measurement and Management Symposium - SEMI-THERM, 15/03/2015, p.107-112Publication A modeling and experimental method for accurate thermal analysis of AlGan/GaN HEMT power-bars
Proceedings paper2015, IEEE 27th International Symposium on Power Semiconductor Devices and ICs - ISPSD, 10/05/2015, p.377-380Publication Advancements in thermal-fluid engineering and its application to electronics cooling system design
Publication Conjugate heat transfer and fluid flow model for microjet cooling with alternating feeding and draining channels
Journal article2019, Fluids, (4) 3, p.145Publication Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling
Proceedings paper2007-01, Thermal Challenges for Next Generation Electronics Cooling II - THERMES, 7/01/2007, p.223-232Publication Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling
Journal article2008-07, Microelectronics Journal, (39) 7, p.966-974Publication Convolution-based fast thermal model for 3D-ICs: transient experimental validation
Journal article2017, IEEE Transactions on Components, Packaging and Manufacturing Technology, (7) 2, p.221-228Publication Cooling of microelectronics using electrostatic actuated liquid droplets
Oral presentation2007, 2nd European Advanced Technology Workshop on Micropackaging and Thermal ManagementPublication Digital and continuous liquid cooling for electronic systems
Proceedings paper2007-04, EuroSimE: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 16/04/2007, p.685-691Publication Distributed electro-thermal model based on fast and scalable algorithm for GaN power devices and circuit simulations
Proceedings paper2017-05, IEEE 29th International Symposium on Power Semiconductor Devices and ICs - ISPSD, 28/05/2017, p.179-182Publication Experimental and numerical investigation of the direct jet impinging cooling on lidded or lidless package for 2.5D integrated systems using 3D printing technology
Journal article2020, Applied Thermal Engineering, 164, p.114535Publication Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications
; ; ; Publication Experimental benchmarking of electrical methods and $l-Raman spectroscopy for channel temperature detection in AlGaN/GaN HEMTs
Journal article2016, IEEE Transactions on Electron Devices, (63) 6, p.2321-2327Publication Fast and distributed thermal model for thermal modeling of GaN power devices
Journal article2018-10, IEEE Transactions on Components, Packaging and Manufacturing Technology, (8) 10, p.1747-1755Publication Fast convolution based thermal model for 3D-ICs: methodology, accuracy analysis and package impact
Journal article2014-12, Microelectronics Journal, (45) 12, p.1746-1752Publication Fast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICs
Journal article2016, IEEE Transactions on Components, Packaging and Manufacturing Technology, (6) 3, p.424-431Publication First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications
Proceedings paper2019-05, IEEE 69th Electronic Components and Technology Conference - ECTC, 28/05/2019, p.126-134Publication Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets
Journal article2022-01, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 182, p.121865Publication High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler
; ; ; ; ; Proceedings paper2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.733-736