Browsing by Author "Capuz, Giovanni"

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

3D stacking using bump-less process for sub 10μm pitches

A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking

A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

An alternative 3D packaging route thru wafer reconstruction

Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

Comparison of electrical properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfills

Confined IMCs for low temperature and high throughput D2W bonding

Cu-Cu insertion bonding technique using photosensitive polymer as WLUF

Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Die to wafer 3D stacking for below 10μm pitch microbumps

Exploring process interaction of no-flow underfill and thermo-compression bonding in D2D stacking

Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking

Low warpage wafer level transfer molding post 3D die to wafer assembly