Browsing by Author "De Wolf, Ingrid"
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Publication 1/f noise measurements for faster electromigration characterization
Proceedings paper2016, IEEE International Reliability Physics Symposium - IRPS, 17/04/2016, p.5B.3Publication 1/f noise measurements for faster evaluation of electromigration in advanced microelectronics interconnections
Journal article2016, Journal of Applied Physics, (119) 18, p.184302Publication 11-Megapixel CMOS-integrated SiGe micromirror arrays for high-end applications
Journal article2010, Journal of Microelectromechanical Systems, (19) 1, p.202-214Publication 3-D technology: failure analysis challenges
Journal article2016, EDFA Magazine (Electronic Device Failure Analysis), (18) 4, p.24-29Publication 3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Proceedings paper2012, IEEE International Conference on IC Design and technology - ICICDT, 30/05/2012Publication 3D Device/package fault isolation and failure analysis
Oral presentation2017, 43rd International symposium for testing and failure analysis (ISTFA)Publication 3D IC analysis using magnetic field imaging
Meeting abstract2013, 33rd Annual Nano Testing symposium, 13/11/2013Publication 3D Integration: Circuit design, test and reliability challenges
Proceedings paper2010, 16th IEEE International On-Line Testing Symposium - IOLTS, 5/07/2010, p.217Publication 3D Localization of liner breakdown within Cu filled TSV?s by backside LIT and PEM defocusing series
Proceedings paper2017, 43rd International Symposium for Testing and Failure Analysis - ISTFA, 5/11/2017, p.38-43Publication 3D MEMS Metrology @ IMEC: opportunities and problems
Oral presentation2008, Semi Standards Meeting on 3D MEMS MetrologyPublication 3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.2383-2390Publication 3D stacking induced mechanical stress effects
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.309-315Publication 3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
Proceedings paper2015, 31st Semiconductor Thermal Measurement and Management Symposium - SEMI-THERM, 15/03/2015, p.107-112Publication 50Gb/s C-band GeSi waveguide electro-absorption modulator
Proceedings paper2016, Optical Fiber Communications Conference - OFC, 20/03/2016, p.Tu3D.7Publication A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Journal article2022, MICROELECTRONICS RELIABILITY, 138, p.114632Publication A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper Interconnects
Journal article2024, NANOMATERIALS, (14) 22, p.Art. 1834Publication A comprehensive model to predict the charging and reliability of capacitive RF MEMS switches
Journal article2004, Journal of Micromechanics and Microengineering, (14) 4, p.514-521Publication A Critical Analysis of the Thermo-Optic Time Constant in Si Photonic Devices
Journal article2024, PHOTONICS, (11) 7, p.Art. 603Publication A dedicated loading instrument for characterization and testing of MEMS
Proceedings paper2005, Microsystem Technologies, 5/08/2005, p.538-545Publication A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
Journal article2023, JOURNAL OF APPLIED PHYSICS, (134) 13, p.Art. 135102