Browsing by Author "Delie, Gilles"
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Publication Airgap Integration in MP18 Two-Level Semi-damascene Interconnects with Fully Self-aligned Vias
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024Publication Demonstration of MP18-26nm Ru Semi-Damascene Spacer-is-Dielectric SADP Integration
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024Publication Energy band alignment in MoS₂/HfO₂: Transfer-related artifacts and interfacial effects
Journal article2025, JOURNAL OF APPLIED PHYSICS, (137) 24, p.244304-1-244304-9Publication Impact of CVD chemistry on band alignment at the MoS2/SiO2 interface
Journal article2023, SOLID-STATE ELECTRONICS, 209, p.Art. 108782Publication Ion Beam Deposition of Ruthenium for Interconnect Applications in a Direct Metal Etch Approach
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps
; ; ; ; ; Proceedings paper2025-01-01, 2025 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS, 2025-03-30Publication MP16/18 Integration in Ru Semi-Damascene using SiN-Based Core for Spacer-is-Dielectric SADP
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Optimized Two Metal Level Semi-Damascene Interconnects For Superconducting Digital Logic
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Redefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking three different Fully Self-aligned Via options
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024Publication Robust Overlay Control in 2-Level Semi-Damascene
; ; ; ; ; Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Selecting alternative metals for advanced interconnects
Journal article2024-11-07, Journal of Applied Physics, (136) 17, p.171101Publication Self-aligned 8nm T2T as cell boundary in the middle-of-line
Proceedings paper2024, 2024 International Interconnect Technology Conference, 2024-06-03Publication Thermally-Induced Morphology Changes in Subtractive Ru Lines and Their Mitigation
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Two-level Semi-damascene interconnect with fully self-aligned Vias at MP18
Proceedings paper2023, IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023Publication Two-metal-level semi-damascene interconnect with variable width bottom metal at metal pitch 18-26 nm and aspect ratio 4-6 routed using fully self-aligned via
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication UV surface pre-treatment and wet cleaning of Ruthenium MP18 semi-damascene structures
; ; ; ;Tanaka, Tomoya ;Nakano, TeppeiProceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Variability of band alignment between WS2 and SiO2: Intrinsic versus extrinsic contributions
;Delie, Gilles ;Litwin, Peter M. M. ;Abad, Gaby C. C. ;McDonnell, Stephen J. J.Chiappe, DanieleJournal article2022, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, (40) 6, p.062201