Browsing by Author "Derakhshandeh, Jaber"

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

3D interconnects for quantum computing

3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures

3D stacking of Co and Ni based microbumps

3D stacking using bump-less process for sub 10μm pitches

A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks

A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking

A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking

A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking

A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly

A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking

An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem

Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications

Chemical mechanical polishing for indium bond pad damascene processing

Co-Sn intermetallic compoundsfor potential integration in 3D interconnects

Cobalt UBM for fine pitch microbump applications in 3DIC

Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking