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Browsing by Author "Dussart, R."

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    A novel low temperature etch approach to reduce ULK plasma damage

    Zhang, Liping  
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    de Marneffe, Jean-Francois  
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    Leroy, F.
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    Ljazouli, R.
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    Lefaucheux, P.
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    Tillocher, T
    Meeting abstract
    2015, Plasma Etch and Strip in Microtechnology - PESM, 27/04/2015
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    Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturing

    Dussart, R.
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    Lefaucheux, P.
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    Tillocher, T.
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    Ranson, P.
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    Boufnichel, M.
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    Ljazouli, R.
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    Zhang, Liping  
    Meeting abstract
    2013, Plasma Etch and Strip in Microtechnology - PESM, 14/03/2013
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    Cryoetching of silicon and advanced materials for 3D interconnects

    Dussart, R.
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    Tillocher, T.
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    Gosset, N
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    Lefaucheux, P.
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    L'jazouli, R
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    Boufnichel, M.
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    Zhang, Liping  
    Meeting abstract
    2014, ECS Fall Meeting Symposium P5: Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6, 5/10/2014, p.1689
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    Cryogenic etching of porous organosilicate low-k materials: fluorine based plasma analysis

    Leroy, F
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    Tillocher, T
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    Zhang, Liping  
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    Girard, A.
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    Cardinaud, C.
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    Lefaucheux, P.
    Meeting abstract
    2015, Plasma Etch and Strip in Microtechnology - PESM, 27/04/2015
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    Damage free cryogenic etching of a porous organosilica ultralow-k film

    Zhang, Liping  
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    Leffaucheux, P.
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    Tillocher, T.
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    Dussart, R.
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    Mankelevich, Y.
    Journal article
    2013, Electrochemical and Solid-State Letters, (2) 2, p.N5-N7
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    Low-k cryo-etching : comparison of four different High Boiling Point Organic (HBPO)

    Chanson, Romain
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    Lefaucheux, P.L.
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    Dussart, R.
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    Tillocher, T.
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    Shen, P.
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    Urabe, K.
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    Dussarat, C.
    Meeting abstract
    2017, AVS 64th International Symposium & Exhibition, 28/10/2017, p.EM-ThP5
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    Plasma cryoetching processes for silicon and advanced materials

    Dussart, R.
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    Tillocher, T.
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    Gosset, N.
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    Vital, A
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    Lefaucheux, P.
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    L'jazouli, R
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    Boufnichel, M.
    Meeting abstract
    2014, International Conference on Microelectronics and Plasma Technology - ICMAP, 8/07/2014
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    Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process

    Tillocher, T.
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    Leroy, F.
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    Zhang, Liping  
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    Lefaucheux, P.
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    Yatsuda, K.
    ;
    Maekawa, K.
    Proceedings paper
    2015, 22nd International Symposium on Plasma Chemistry - ISPC, 5/07/2015, p.O-8-1

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