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Browsing by Author "Fahle, Dirk"

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    650 V p-GaN gate power HEMTs on 200 mm engineered substrates

    Geens, Karen  
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    Li, Xiangdong  
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    Zhao, Ming  
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    Guo, Weiming
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    Wellekens, Dirk  
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    Posthuma, Niels  
    Proceedings paper
    2019, 7th Workshop on Wide Bandgap Power Devices and Applications - WIPDA 2019, 29/10/2019, p.292-296
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    Demonstration of High-quality GaN Epitaxy on 200 mm Engineered Substrates for Vertical Power Device Fabrication

    Geens, Karen  
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    Hahn, Herwig  
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    Liang, Hu  
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    Borga, Matteo  
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    Cingu, Deepthi  
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    You, Shuzhen  
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    Marx, Matthias
    Proceedings paper
    2021, 2021 International Conference on Compound Semiconductor Manufacturing Technology (CS Mantech), 24/05/2021
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    Development and analysis of thick GaN drift layers on 200 mm CTE-matched substrate for vertical device processing

    Filho Goncalez, Walter  
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    Borga, Matteo  
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    Geens, Karen  
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    Cingu, Deepthi  
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    Chatterjee, Urmimala  
    Journal article
    2023, SCIENTIFIC REPORTS, (13) N/, p.Art. 15931
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    Epitaxial buffer structures grown on 200 mm engineering substrates for 1200 V E-mode HEMT application

    Vohra, Anurag  
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    Geens, Karen  
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    Zhao, Ming  
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    Syshchyk, Olga  
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    Hahn, Herwig
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    Fahle, Dirk
    Journal article
    2022, APPLIED PHYSICS LETTERS, (120) 26, p.261902
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    Epitaxial growth and characterization of P-GaN gated HEMT on compliant poly-AlN substrate for e-mode power devices

    Guo, Weiming
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    Geens, Karen  
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    Zhao, Ming  
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    Behmenburg, Hannes
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    Fahle, Dirk
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    Odnoblyudov, Vlad
    Meeting abstract
    2018, International Workshop on Nitride Semiconductors - IWN, 11/11/2018, p.GR12-7
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    Epitaxial growth by MOCVD on 200 mm engineered substrates for power devices & ICs beyond 650 V

    Fahle, Dirk
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    Zhao, Ming  
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    Geens, Karen  
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    Li, Xiangdong  
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    Wellekens, Dirk  
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    Magnani, Alessandro  
    Meeting abstract
    2019, DGKK Workshop "Epitaxy of III-V Semiconductors", 5/12/2019
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    Growth and characterization of buffer structures for AlGaN/GaN-based heterostructure field effect transistors

    Eickelkamp, Martin
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    Fahle, Dirk
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    Mauder, Christof
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    Saripalli, Yoga
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    Zhao, Ming  
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    Liang, Hu  
    Meeting abstract
    2016, International Workshop on Nitride Semiconductors - IWN, 2/10/2016
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    Growth and characterization of buffer structures for AlGaN/GaN-based heterostructure field effect transistors

    Eickelkamp, Martin
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    Fahle, Dirk
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    Mauder, Christof
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    Saripalli, Yoga
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    Zhao, Ming  
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    Liang, Hu  
    Meeting abstract
    2016, DGKK-Workshop, 8/12/2016
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    Growth and characterization of buffer structures for high power enhancement-mode AlGaN/GaN HEMT

    Martin, Eickelkamp
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    Fahle, Dirk
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    Mauder, Christof
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    Zhao, Ming  
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    Liang, Hu  
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    Posthuma, Niels  
    Meeting abstract
    2017, 12th International Conference on Nitride Semiconductors - ICNS, 24/07/2017
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    Integration of 650 V GaN power ICs on 200 mm engineered substrates

    Li, Xiangdong  
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    Geens, Karen  
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    Wellekens, Dirk  
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    Zhao, Ming  
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    Magnani, Alessandro  
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    Amirifar, Nooshin  
    Journal article
    2020, IEEE Transactions on Semiconductor Manufacturing, (33) 4, p.534-538
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    Integration of GaN power ICs on 200 mm engineered substrates

    Li, Xiangdong  
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    Geens, Karen  
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    Wellekens, Dirk  
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    Zhao, Ming  
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    Magnani, Alessandro  
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    Amirifar, Nooshin  
    Proceedings paper
    2020, 2020 International Conference on Compound Semiconductor Manufacturing Technology, 24/05/2020, p.241-244
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    p-GaN e-mode HEMT power device manufacturing on 200mm substrates using aixtron AIX G5+C MOCVD system

    Liang, Hu  
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    Posthuma, Niels  
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    Eickelkamp, Martin
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    Fahle, Dirk
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    Van Hove, Marleen
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    Zhao, Ming  
    Meeting abstract
    2016, 13th China International Forum on Solid State Lighting - SSLCHINA, 15/11/2016
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    Vertical GaN devices: Process and reliability

    You, Shuzhen  
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    Geens, Karen  
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    Borga, Matteo  
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    Liang, Hu  
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    Hahn, Herwig
    ;
    Fahle, Dirk
    ;
    Heuken, Michael
    Journal article
    2021, MICROELECTRONICS RELIABILITY, 126

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