Browsing by Author "Fahle, Dirk"
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Publication 650 V p-GaN gate power HEMTs on 200 mm engineered substrates
Proceedings paper2019, 7th Workshop on Wide Bandgap Power Devices and Applications - WIPDA 2019, 29/10/2019, p.292-296Publication Demonstration of High-quality GaN Epitaxy on 200 mm Engineered Substrates for Vertical Power Device Fabrication
; ; ; ; ; ; Marx, MatthiasProceedings paper2021, 2021 International Conference on Compound Semiconductor Manufacturing Technology (CS Mantech), 24/05/2021Publication Development and analysis of thick GaN drift layers on 200 mm CTE-matched substrate for vertical device processing
Journal article2023, SCIENTIFIC REPORTS, (13) N/, p.Art. 15931Publication Epitaxial buffer structures grown on 200 mm engineering substrates for 1200 V E-mode HEMT application
Journal article2022, APPLIED PHYSICS LETTERS, (120) 26, p.261902Publication Epitaxial growth and characterization of P-GaN gated HEMT on compliant poly-AlN substrate for e-mode power devices
Meeting abstract2018, International Workshop on Nitride Semiconductors - IWN, 11/11/2018, p.GR12-7Publication Epitaxial growth by MOCVD on 200 mm engineered substrates for power devices & ICs beyond 650 V
Meeting abstract2019, DGKK Workshop "Epitaxy of III-V Semiconductors", 5/12/2019Publication Growth and characterization of buffer structures for AlGaN/GaN-based heterostructure field effect transistors
Meeting abstract2016, International Workshop on Nitride Semiconductors - IWN, 2/10/2016Publication Growth and characterization of buffer structures for AlGaN/GaN-based heterostructure field effect transistors
Meeting abstract2016, DGKK-Workshop, 8/12/2016Publication Growth and characterization of buffer structures for high power enhancement-mode AlGaN/GaN HEMT
Meeting abstract2017, 12th International Conference on Nitride Semiconductors - ICNS, 24/07/2017Publication Integration of 650 V GaN power ICs on 200 mm engineered substrates
; ; ; ; ; Journal article2020, IEEE Transactions on Semiconductor Manufacturing, (33) 4, p.534-538Publication Integration of GaN power ICs on 200 mm engineered substrates
; ; ; ; ; Proceedings paper2020, 2020 International Conference on Compound Semiconductor Manufacturing Technology, 24/05/2020, p.241-244Publication p-GaN e-mode HEMT power device manufacturing on 200mm substrates using aixtron AIX G5+C MOCVD system
Meeting abstract2016, 13th China International Forum on Solid State Lighting - SSLCHINA, 15/11/2016Publication Vertical GaN devices: Process and reliability
; ; ; ; ;Hahn, Herwig ;Fahle, DirkHeuken, MichaelJournal article2021, MICROELECTRONICS RELIABILITY, 126