Browsing by Author "Guo, Bin"
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Publication A CMOS compatible polycrystalline silicon-germanium based piezoresistive pressure sensor
Proceedings paper2011, 16th International Conference on Solid-State Sensors, Actuators and Microsystems - Transducers, 5/06/2011, p.1076-1079Publication A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator
Proceedings paper2011, 16th International Solid-State Sensors, Acutators and Microsystems Conference - TRANSDUCERS, 5/06/2011, p.982-985Publication Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
; ; Proceedings paper2011, IEEE 24th International Conference on Micro Electro Mechanical Systems - MEMS, 23/01/2011, p.352-355Publication CMOS compatible polycrystalline silicon-germanium based pressure sensors
Journal article2012, Sensors and Actuators A: Physical, 188, p.9-18Publication Development, optimization and evaluation of a CF4 pre-treatment process to remove unwanted interfacial layers in stacks of CVD and PECVD polycrystalline silicon-germanium for MEMS applications
Meeting abstract2010, 217th ECS Meeting, 25/04/2010, p.1817Publication Development, optimization and evaluation of a CF4 pretreatment process to remove unwanted interfacial layers in stacks of CVD and PECVD polycrystalline silicon-germanium for MEMS applications
Proceedings paper2010, Sensors, Actuators, and Microsystems (General), 25/04/2010, p.79-90Publication High-Q torsional mode Si triangular beam resonators encapsulated using SiGe thin film
Proceedings paper2010, IEEE International Electron Devices Meeting - IEDM, 6/12/2010, p.154-157Publication Improvement of PECVD silicon–germanium crystallization for CMOS compatible MEMS applications
; ; ; ; Journal article2010, Journal of the Electrochemical Society, (157) 2, p.D103-D106Publication Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Journal article2011, Microelectronics Reliability, (51) 9_11, p.1878-1881Publication Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Proceedings paper2012, 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA, 2/06/2012, p.1-1Publication Poly-SiGe-based MEMS thin-film encapsulation
; ; ; Journal article2012, Journal of Microelectromechanical Systems, (110) 120, p.21-1Publication Sealing of poly-SiGe surface micromachined cavities for MEMS-above-CMOS applications
Journal article2011, Journal of Micromechanics and Microengineering, (21) 11, p.115019Publication Thin film encapsulated SiGe accelerometer for MEMS above IC integration
Proceedings paper2011, 16th International Conference on Solid-State Sensors, Actuators, and Microsystems - Transducers, 5/06/2011, p.2046-2049