Browsing by Author "Iwasaki, Akihisa"
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Publication BEOL pre-metallization wet clean: post-etch residue removal and metal compatibility
Meeting abstract2018, Surface Preparation and Cleaning Conference - SPCC, 9/04/2018Publication Controlled ALE-type recess of molybdenum for future logic and memory applications
Proceedings paper2021, IEEE International Interconnect Technology Conference (IITC), JUL 06-09, 2021Publication Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
Proceedings paper2016, IEEE 18th Electronics Packaging Technology Conference - EPTC, 30/11/2016, p.107-110Publication Etching of molybdenum via a combination of low-temperature ozone oxidation and wet-chemical oxide dissolution
Journal article2023, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, (41) 3, p.Art. 032601Publication Impact of dissolved oxygen in dilute HF solution on material etch
Proceedings paper2016, Ultra Clean Processing of Semiconductor Surfaces XIII - UCPSS, 11/09/2016, p.251-254Publication Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification
Proceedings paper2016, IEEE 18th Electronics Packaging Technology Conference - EPTC, 30/11/2016, p.441-444Publication Optimization of post etch cobalt compatible clean by pH and oxidizer
; ; ; ; Akanishi, Y.Proceedings paper2018, Ultra Clean Processing of Semiconductor Surfaces XIV - UCPSS, 2/09/2018, p.268-272Publication Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments
Meeting abstract2017, 232nd ECS Fall Meeting: 15th International Symposium on Semiconductor Cleaning Science and Technology - SCST15, 1/10/2017, p.1079Publication Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments
Proceedings paper2017, 232nd ECS Fall Meeting - 15th International Symposium on Semiconductor Cleaning Science and Technology - SCST15, 1/10/2017, p.233-241