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Browsing by Author "List, Scott"

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    157nm resist process performance and integration challenges on a full field scanner

    Goethals, Mieke
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    Gronheid, Roel  
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    List, Scott
    ;
    Ercken, Monique  
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    Van Roey, Frieda  
    Journal article
    2004, Journal of Photopolymer Science and Technology, (17) 4, p.655-674
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    A methodology for the characterization of topography induced immersion bubble defects

    Kocsis, Michael  
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    De Bisschop, Peter  
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    Maenhoudt, Mireille
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    Kim, Young-Chang
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    Wells, Greg
    Proceedings paper
    2005, Optical Microlithography XVIII, 27/02/2005, p.154-163
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    Advanced metrologies for cleans characterization: ARXPS, GIXF and NEXAFS

    Conard, Thierry  
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    List, Scott
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    Claes, Martine  
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    Beckhoff, Buckard
    Proceedings paper
    2008, Ultra Clean Processing of Semiconductor Surfaces VIII - UCPSS, 18/09/2006, p.281-284
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    Cu resistivity scaling limits for 20 nm copper damascene lines

    Van Olmen, Jan  
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    List, Scott
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    Tokei, Zsolt  
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    Carbonell, Laure
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    Brongersma, Sywert  
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    Volders, Henny  
    Proceedings paper
    2007, IEEE International Interconnect Technology Conference - IITC, 4/06/2007, p.49-51
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    Depth-profiling of vertical sidewall nanolayers on structured wafers by grazing incidence X-ray fluorescence

    Honicke, P.
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    Beckhoff, B.
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    Kolbe, M.
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    List, Scott
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    Conard, Thierry  
    ;
    Struyf, Herbert  
    Journal article
    2008, Spectrochimica Acta B, (63) 12, p.1359-1364
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    Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters

    Kobrinsky, M.J.
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    Chakravarty, S.
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    Jiao, D.
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    Harmes, M.C.
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    List, Scott
    ;
    Mazumder, M.
    Journal article
    2005, IEEE Trans. Advanced Packaging, (28) 1, p.57-62
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    High performance 3D : a cost benefit analysis

    List, Scott
    ;
    Beyne, Eric  
    Oral presentation
    2007, SEMI Technical Symposium: Innovations in Semiconductor Manufacturing
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    Phase identification of self-forming Cu-Mn based diffusion barriers on p-SiOC:H and SiO2 dielectrics using x-ray absorption fine structures

    Ablett, James
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    Woicik, Joseph
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    Tokei, Zsolt  
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    List, Scott
    ;
    Dimasi, Elaine
    Journal article
    2009, Applied Physics Letters, (94) 4, p.42112
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    The third dimension: fact or fiction?

    List, Scott
    Oral presentation
    2005, 3D Architectures for Semiconductor Integration and Packaging
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    Thermo-mechanical properties of thin organosilicate glass films treated by ultra-violet-assisted cure

    Iacopi, Francesca
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    Beyer, Gerald  
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    Travaly, Youssef
    ;
    Waldfried, Carlo
    ;
    Gage, David M.
    Journal article
    2007-02, Acta Materialia, (55) 4, p.1407-1414

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