Browsing by Author "Maekawa, Kaoru"

Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL)

Cryoetching processes applied to ULK material

Low damage cryoetching of low-K materials

Low damage ULK etching by means of high boiling point organic condensation

Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage

Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation

Novel volatile film for the protection of organo-silicate glass dielectric materials

Paths towards low-damage etching of highly porous organo-silicate low-k dielectrics

Use of a thermally degradable chemical vapor deposited polymer film for low damage plasma processing of highly porous dielectrics