Browsing by Author "Mandrekar, T."
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Publication Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Proceedings paper2005, Materials, Technology, and Reliability of Advanced Interconnects Interconnects, 28/03/2005, p.265-270Publication Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects
Proceedings paper2005, Adanced Metallization Conference 2004, 19/10/2004, p.801-805Publication Barrier reliability on sub-100nm copper low-k interconnects
Oral presentation2004, Advanced Metallization ConferencePublication Barrier studies on porous silk semiconductor dielectric
Journal article2003, Microelectronic Engineering, (70) 2_4, p.352-357Publication Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.403-407Publication Cu resistivity scaling limits for 20 nm copper damascene lines
Proceedings paper2007, IEEE International Interconnect Technology Conference - IITC, 4/06/2007, p.49-51Publication Reliability studies of MOCVD TiSin and EnCoRe Ta(N)/Ta
Journal article2003, Microelectronic Engineering, (70) 2_4, p.358-362Publication Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Oral presentation2007, Advanced Metallization Conference: 17th Asian Session - ADMETA