Browsing by Author "Miller, Andy"
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Publication 10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.617-622Publication 3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication 3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Proceedings paper2016, IEEE 18th Electronic Packaging Technology Conference - EPTC, 30/11/2016, p.791-796Publication 3D interconnects for quantum computing
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.821-828Publication 3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
Proceedings paper2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3Publication 3D stacking of Co and Ni based microbumps
; ; ; ; Publication 3D stacking using bump-less process for sub 10μm pitches
Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.128-133Publication 3D-SoC integration utilizing high accuracy wafer level bonding
Proceedings paper2016, IEEE 18th Electronics Packaging Technology Conference - EPTC, 30/11/2016, p.111-114Publication A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.1035-1040Publication A highly reliable 1×5μm via-last TSV module
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.94-96Publication A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch
Proceedings paper2018, 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.370-378Publication A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking
Proceedings paper2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 26/05/2020Publication A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.1442-1447Publication A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
Meeting abstract2020, IMAPS 53rd International Symposium on Microelectronics, 6/10/2020Publication A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking
Proceedings paper2015, 13th International Wafer Level Packaging Conference - IWLPC, 13/10/2015Publication A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.1119-1124Publication Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2018, p.437Publication Advanced optical lithography: double patterning options for 32 and 22nm node
Oral presentation2009, 2nd International Workshop on Plasma Etch and Strip in Microelectronics - PESM