Browsing by Author "Modlinski, Robert"
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Publication Creep as a reliability problem in MEMS
Journal article2004, Microelectronics Reliability, (44) 9_11, p.1733-1738Publication Creep as a reliability problem in MEMS
Proceedings paper2004, Proceedings 15th MicroMechanics Europe Workshop, 5/09/2004, p.84-87Publication Creep characterization of Al alloy thin films for use in MEMS applications
;Modlinski, Robert ;Witvrouw, Ann ;Ratchev, Petar ;Puers, Robertden Toonder, Jaap M.J.Journal article2004, Microelectronic Engineering, (76) 1_4, p.272-278Publication Creep in MEMS. Failures in MEMS due to creep, plasticity and processing-microstructures-temperatures related mechanisms
Modlinski, RobertPHD thesis2011-01Publication Creep resistant aluminum alloys for use in MEMS
Journal article2005, J. of Micromechanics and Microengineering, (15) 7, p.S165-S170Publication Failure mechanisms and reliability issues of RF-MEMS switches
Proceedings paper2005, 5th ESA-ESTEC Round Table on Micro/Nano Technologies for Space, 3/10/2005Publication Generic RF-MEMS technology platform for mobile and satellite communications
Proceedings paper2005, 5th ESA-ESTEC Round Table on Micro/Nano Technologies for Space, 3/10/2005Publication Mechanical characterisation of poly-SiGe layers for CMOS-MEMS integrated applications
Journal article2010, Journal of Micromechanics and Microengineering, (20) 1, p.15014Publication Micro-tensile tests to characterize MEMS
Proceedings paper2007, Technical Digest 20th IEEE International Conference on Micro Electro Mechanical Systems - MEMS, 21/01/2007, p.255-258Publication Reliability and failure analysis of RF MEMS switches
Proceedings paper2002, Proceedings 28th International Symposium for Testing and Failure Analysis - ISTFA, 7/11/2002, p.275-281Publication Reliability of RF-MEMS: stress relaxation in Al-alloy films
Meeting abstract2003, 14th MicroMechanics Europe Workshop, 2/11/2003Publication Temperature induced microstructural changes and deformation of metal alloys used for RF-MEMS switches
Proceedings paper2005-09, Proceedings of the 16th MicroMechanics Europe Workshop - MME, 4/09/2005, p.183-186Publication The influence of the package environment on the functioning and reliability of capacitive RF-MEMS switches
; ; ; ;Modlinski, Robert; Journal article2005, Microwave Journal, (48) 12, p.102-116