Browsing by Author "Nishimura, Eiichi"
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Publication 28nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy directed self-assembly (DSA) process flow
Oral presentation2013, 39th International Conference on Micro and Nano Engineering - MNEPublication A novel CBRAM integration using subtractive dry-etching process of Cu enabling high-performance memory scaling down to 10nm node
Proceedings paper2015, IEEE Symposium on VLSI Technology, 15/06/2015, p.134-135Publication Direct etched Cu characterization for advanced interconnects
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.173-176Publication Etching of Co-Pd with significantly reduced sidewall re-deposition
Meeting abstract2013, 35th International Symposium on Dry Process, 29/08/2013, p.D-4Publication Low damage cryoetching of low-K materials
Publication LWR reduction by novel lithographic and etch techniques
Proceedings paper2010, Advances in Resist Materials and Processing Technology XXVII, 21/02/2010, p.763914Publication STT MRAM patterning challenges
Proceedings paper2013, Advanced Etch Technology for Nanopatterning II, 24/02/2013, p.86850F