Browsing by Author "Posada Quijano, Guillermo"
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Publication 3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring
Proceedings paper2011, International Conference on Solid State Devices and Materials - SSDM, 28/09/2011Publication 3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance
Proceedings paper2011, 41st European Solid-State Device Research Conference - ESSDERC, 12/09/2011, p.127-130Publication 3D stacking of microwave modules for high-density packaging
Posada Quijano, GuillermoPHD thesis2008-08Publication Compact (<0.5mm2) K-band metamaterial bandpass filter in MCM-D technology
Journal article2007, Electronics Letters, (43) 5, p.45-46Publication High-performance SiP modules
Publication Horizontal integration of cavity filters on high-resistivity silicon thin-film technology
Journal article2008, IEEE Transactions on Microwave Theory and Techniques, (56) 12, p.2893-2901Publication Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules
Meeting abstract2007-11, IMAPS Advanced Technology Workshop on Integrated/Embedded Passives, 15/11/2007Publication Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias
Proceedings paper2007, European Microwave Integrated Circuit Conference - EuMIC, 8/10/2007, p.335-338Publication System-in-a-package technology for 3D integration of radar modules
Proceedings paper2008, Microwaves, Radar and Remote Sensing - MRRS, 22/09/2008Publication Technology platform integrates high-performance SiP modules
Publication Technology platform integrates high-performance SiP modules
Publication Thin-film as enabling passive integration technology for RF SoC and SiP
Proceedings paper2005-02, IEEE International Solid-State Circuits Conference - ISSCC. Digest of Technical Papers, 6/02/2005, p.398-399Publication Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
Proceedings paper2008, 58th Electronic Components and Technology Conference - ECTC, 27/05/2007, p.2060-2066Publication Thin-film multi-chip module technology in high-resistivity Si for the integration of millimeter wave systems
Proceedings paper2005, NEFERTITI Workshop on Millimetre Wave Photonic Devices and Technologies for Wireless and Imaging Applications, 17/01/2005, p.12Publication Thin-film technologies for mm-wave passives and antenna-interface realization
Oral presentation2008, European Microwave ConferencePublication Towards 3D integration of system in a package modules
Publication Ultra-miniaturized integrated cavities on high-resistivity silicon thin-film MCM-D technology
Proceedings paper2008, Topical Meeting on Silicon Monolitic Integrated Circuits in RF Systems - SiRF, 23/01/2008, p.139-142