Browsing by Author "Stoukatch, Serguei"
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Publication A reliable and compact polymer-based package for capacitive RF-MEMS switches
Proceedings paper2004-12, Technical Digest International Electron Device Meeting - IEDM, 13/12/2004, p.31-34Publication Active matrix vacuum fluorescent display with CdSe:In TFTS
; ; Publication Advanced wire bonding: bonding on copper
Proceedings paper2002, Proceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE, 16/06/2002, p.27-32Publication Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture
Proceedings paper2007-05, Proceedings 57th Electronic Components and Technology Conference - ECTC, 29/05/2007, p.249-255Publication Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Proceedings paper2002, Proceedings 4th Electronics Packaging Technology Conference, 10/12/2002, p.60-64Publication Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
Proceedings paper2003, Proceedings 33rd European Microwave Conference, 7/10/2003, p.301-304Publication Copper wire bonding to advanced copper back-end integrated circuits
Oral presentation2003, Semicon Europe, Advanced Packaging SeminarPublication Demonstration of heterogeneous integration of technologies for a Ku-band SiP Doppler radar
Proceedings paper2008, 38th European Microwave Integrated Circuits Conference - EuMA, 27/10/2008, p.1497-1500Publication Direct gold and copper wires bonding on copper
Journal article2003, Microelectronics Reliability, (43) 6, p.913-923Publication Double and triple stacked solder joint technology for further miniaturization of 3D-SIP
Proceedings paper2007, 16th European Microelectronics and Packaging Conference and Exhibition - EMPC, 17/06/2007, p.343-350Publication Electroless nickel plating bath composition and replenishment for microvia plating process
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.447-452Publication Enabling technologies for antenna integration on microwave SiPs
Oral presentation2004, IEEE MTT-S International Microwave Symposium Workshop on Active AntennasPublication FCOB: packaging issues for RF-MEMS applications and reliability study
Proceedings paper2005, Proceedings 15th European Microelectronics and Packaging Conference - EPMC, 12/06/2005, p.195-200Publication Fine pitch copper wire bonding on copper bond pad process optimization
Proceedings paper2002, 4th International Symposium on Electronic Materials and Packaging, 3/12/2002, p.63-68Publication Flip chip assembly using SBB of high frequency GaAs modules
Proceedings paper2002, MicroTech, 29/01/2002Publication Generic RF-MEMS technology platform for mobile and satellite communications
Proceedings paper2005, 5th ESA-ESTEC Round Table on Micro/Nano Technologies for Space, 3/10/2005Publication High density 3-D stack structure for SIP solutions
Proceedings paper2003, 14th European Microelectronics and Packaging Conference & Exhibition - EMPC, 23/02/2003, p.341-343Publication Kupfer-zu-Kupfer Wire-Bonding erfordert eine Anpassung des Bondprozesses - Massnahmen gegen die Oxidationsgefahr
Journal article2004-04, Elektronik Produktion & Prüftechnik, p.50-52Publication Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process
Proceedings paper2003, EPTC - Electronics Packaging Technology Conference, 10/12/2003, p.815-820Publication Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
Journal article2005, Microelectronics Reliability