Browsing by Author "Uhrmann, Thomas"
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Publication A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
; ; ; ; Publication Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.985-992Publication Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Publication Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects
Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4Publication Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications
Meeting abstract2017, The International Conference on Wafer Bonding - Waferbond, 27/11/2017Publication Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.386-393Publication IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.343-347