Browsing by Author "Urbanowicz, Adam"

Advanced nanoporous functional layer materials with extremely low dielectric constant

Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects

Challenges of plasma damage of low-k materials

Changes of UV optical properties of plasma damaged low-k dielectrics for sidewall damage scatterometry

Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment

Effect of energetic ions on plasma damage of SiCOH low-k material

Effect of energetic ions on plasma damage of SiCOH low-k material

Effect of helium plasma on low-k damage during dry resist strip

Effect of porogen residue on chemical, optical, and mechanical properties of CVD SiCOH low-k materials

Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance

Effect of UV wavelength on the hardening process of porogen-containing and porogen-free ultra-low-k PECVD dielectrics

Effect of UV-wavelength on hardening process of porogen-containing and porogen-free ultra-low-k PECVD glasses

Effects of bias, pressure and temperature in plasma damage of ultra low-k films

Effects of He plasma pre-treatment on low-k damage during post Cu surface ceaning with NH3 plasma

Effects of plasma chemistry on low-k film properties

Engineering of chemical and physical properties of low-k materials by different wavelength of UV light

Evaluation of plasma damage in patterned low-k structures by near-field scanning probe microwave microscope: effect of plasma ash chemistry

Fabrication of porogen residue free ultra low-k PECVD material by subsequent H2-afterglow plasma treatment and UV curing

Fullerene based materials for ultra-low-k application

Improved low-k dielectric properties using He/H2 plasma for resist removal