Browsing by Author "Walsby, Edward"
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Publication Characterization of optical end-point detection for via reveal processing
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1181-1187Publication Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2064-2070Publication Direct Bonding Using Low Temperature SiCN Dielectrics
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.602-607Publication Etch process modules development and integration in 3D SOC applications
Meeting abstract2017, 10th International Workshop on Plasma Etch and Strip in Microtechnology - PESM, 19/10/2017Publication Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1-8Publication Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
; ; ; ; ; Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.42-48Publication Extreme wafer thinning optimization for via-last applications
; ; ; ; ; Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4Publication Low temperature SiCN as dielectric for hybrid bonding
Proceedings paper2023, 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM), MAR 07-10, 2023Publication RIE dynamics for extreme wafer thinning applications
Meeting abstract2017, PESM, 20/10/2017Publication Silicon microfluidics: an enabling technology for life sciences application
Proceedings paper2017, IMAPS 50th Anniversary Symposium, 9/10/2017Publication Vapor deposited thin organic-inorganic capping layers preventing copper line oxidation in polymer-based RDL technologies
Journal article2022-10-15, Microelectronic Engineering, (266) 15 October 2022, p.111896-111902