Browsing by Author "Wen, Lianggong"
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Publication A comb based in-plane SiGe capacitive accelerometer for above-IC integration
Proceedings paper2010, 21st Micromechanics and Microsystems Europe Workshop - MME, 26/09/2010, p.212-215Publication A parylene temporary packaging technique for MEMS wafer handling
Journal article2012, Sensors and Actuators A: Physical, 186, p.289-297Publication Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
; ; Proceedings paper2011, IEEE 24th International Conference on Micro Electro Mechanical Systems - MEMS, 23/01/2011, p.352-355Publication An in-plane SiGe differential capacitive accelerometer for above-IC integration
Journal article2011-07, Journal of Micromechanics and Microengineering, (21) 7, p.74011Publication Design and characterisation of a CMOS compatible poly-SiGe low-g capacitive accelerometer
Proceedings paper2010, Eurosensors XXIV, 5/09/2010Publication Poly-SiGe-based MEMS thin-film encapsulation
; ; ; Journal article2012, Journal of Microelectromechanical Systems, (110) 120, p.21-1Publication Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process
Proceedings paper2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3Publication SiGe MEMS technology: a platform technology enabling different demonstrators
Proceedings paper2010, SiGe, Ge, and Related Compounds 4: Materials, Processing and Devices, 10/10/2010, p.799-812Publication SiGe MEMS technology: a platform technology enabling different demonstrators
Meeting abstract2010, 218th ECS Conference, 10/10/2010, p.1937