Browsing by Author "Wu, Wen"

Barriers for Cu/low k damascene structures

Corrosion of narrow copper damascene interconnects

Corrosion of the copper damascene interconnects as a function of the electrochemical plating process parameters

Electrical and microstructural characterization of narrow Cu interconnects

Electrical and microstructural characterization of narrow Cu interconnects

Fabrication and transport properties of ultra-fine copper interconnects

Fabrication of 100 nm pitch copper interconnects by electron beam lithography

Grain growth in copper interconnect lines

Influence of electrochemical plating process parameters on corrosion of Cu damascene interconnects

Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions

Integration of single damascene 85/85nm/L/S copper trenches in black diamond using 193nm optical lithography with dipole illumination

Non-destructive determination of pore size distribution of low-k porous SOG films

Resistivity of ultra-narrow Cu interconnects fabricated with ion beam lithography

Studies on size effect of copper interconnect lines

The thickness and temperature dependent resistivity of thin copper films

Thickness and temperature dependent resistivity of thin copper films