Browsing by Author "Zhang, Wenqi"

3D

3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring

3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance

3D stacking using ultra thin dies

3D system integration - opportunities and challenges

3D technology enabling innovative smart system integration

Analysis of microbump induced stress effects in 3D stacked IC technologies

Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity

Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices

Characterization of oxidation of the electroplated Sn for advanced flip-chip bonding

Continued scalability of copper/low-k interconnects

Copper grain growth in reduced dimensions

Cu/Sn microbumps interconnect for 3D TSV chip stacking

Dependence of energy distributions of interface states on stress conditions

Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration

Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization

Fine pitch micro-bump interconnections for advanced 3D chip stacking

Formation of compounds and Kirkendall vacancy in the Cu-Sn system

Geometry effect on impurity incorporation and grain growth in narrow copper lines

High density 20μm pitch CuSn microbump process for high-end 3D applications