Browsing by Author "van Haren, Richard"
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Publication Characterisation of direct alignment for LFLE process
Proceedings paper2009, 6th Internation Symposium on Immersion Lithography Extensions, 22/10/2009Publication Co-optimizatin of RegC and TWINSCANTM corrections to improve the intra-field on-product overlay performance
Proceedings paper2016, Metrology, Inspection, and Process Control for Microlithography XXX, 21/02/2016, p.97783DPublication Etch tool pressure optimization enabling wafer edge overlay control.
Oral presentation2020, ASML Technology Conference 2020Publication Intra-field etch induced overlay penalties
Proceedings paper2020, Advanced Etch Technology for Nanopatterning IX, 23/02/2020, p.1132910Publication Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
Proceedings paper2018, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology, 18/04/2018, p.108070KPublication Intra-field stress impact on global wafer deformation
Proceedings paper2019, Metrology, Inspection, and Process Control for Microlithography XXXIII, 24/02/2019, p.109591IPublication Metal Etch Depth Metrology using YieldStar and CDSEM
Proceedings paper2024, 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), MAY 13-16, 2024Publication Mitigation of the etch-induced intra-field overlay contribution
Publication Off-line mask-to-mask registration characterization
Meeting abstract2017, Photomask Photomask Technology and EUV Lithography, 11/09/2017, p.1045111-1-1045111-16Publication On product overlay characterization after stressed layer etch
Proceedings paper2021, Advanced Etch Technology and Process Integration for Nanopatterning X, 21/02/2021, p.116150NPublication The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
; ; Publication The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
; ; Publication The mask contribution as part of the intra-field on-product overlay performance
Proceedings paper2020, Photomask Technology Conference, SEP 21-25, 2020Publication The mask contribution as part of the intra-field on-product overlay performance
; ; Publication Wafer alignment mark placement accuracy impact on the layer to layer overlay performance
; ; Publication Wafer shape based in-plane distortion predictions using superfast 4G metrology
Proceedings paper2017, Metrology, Inspection, and Process Control for Microlithography XXXI,, 31/01/2017, p.101452L