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0-level packaging for (RF-)MEMS

0-Level packaging techniques for flip-chip mounted MMICs

0.13µm CMOS technology with optimized poly-Si / NO-oxide gate stack

0.18 μm KrF lithography using optical proximity correction based on empirical behavior modeling

0.18 μm lithography : using 248 nm deep-UV and top surface imaging

0.25 µm optical lithography based on surface imaging and dry development

0.35V time-domain-based instrumentation amplifier

0.3pA Dark Current and 0.65A/W Responsivity 1020nm InGaAs/GaAs Nano-Ridge Waveguide Photodetector Monolithically Integrated on a 300-mm Si Wafer

0.5 nm EOT low leakage ALD SrTiO3 on TiN MIM capacitors for DRAM applications

0.5µm and 0.35µm BiCMOS - silicon etch developement at IMEC

0.6V 0.015mm2 time-based biomedical readout for ambulatory applications in 40nm CMOS

0.7 V supply self-biased nanoWatt MOS-only threshold voltage monitor

'1 Thru +2.5 Reflects': A new technique for de-embedding MIC/MMIC device measurements in fixed-length fixtures

-1 V bias 56 Gbps germanium waveguide p-i-n photodetector with silicon contacts

-1 V bias 67 GHz bandwidth si-contacted germanium waveguide p-i-n photodetector for optical links at 56 Gbps and beyond

1 μm-thin crystalline silicon solar cells with amorphous-ordered nanotextures (PhotoNVoltaics project)

1, 2, 3, Fork: Counter Mode Variants based on a Generalized Forkcipher

1,7 kHz RF linewidth III-V-on-silicon mode-locked laser

1-((2,4-dichlorophenethyl)amino)-3-phenoxypropan-2-ol kills Pseudomonas aeruginosa through extensive membrane damage

1-D model of OSG low-k films modification by EUV/VUV emission