Browsing by Type "Proceedings paper"

0-Level packaging techniques for flip-chip mounted MMICs

0.13µm CMOS technology with optimized poly-Si / NO-oxide gate stack

0.25 µm optical lithography based on surface imaging and dry development

0.3pA Dark Current and 0.65A/W Responsivity 1020nm InGaAs/GaAs Nano-Ridge Waveguide Photodetector Monolithically Integrated on a 300-mm Si Wafer

0.5 nm EOT low leakage ALD SrTiO3 on TiN MIM capacitors for DRAM applications

0.6V 0.015mm2 time-based biomedical readout for ambulatory applications in 40nm CMOS

0.7 V supply self-biased nanoWatt MOS-only threshold voltage monitor

'1 Thru +2.5 Reflects': A new technique for de-embedding MIC/MMIC device measurements in fixed-length fixtures

-1 V bias 56 Gbps germanium waveguide p-i-n photodetector with silicon contacts

1 μm-thin crystalline silicon solar cells with amorphous-ordered nanotextures (PhotoNVoltaics project)

1,7 kHz RF linewidth III-V-on-silicon mode-locked laser

1.25GHz repetition rate operation of a SOA-DFB laser diode based all-optical flip-flop

1.5×10-9 Ω·cm² Contact Resistivity on Highly Doped Si:P Using Ge Pre-amorphization and Ti Silicidation

1.9 nm wide ultra-high aspect-ratio bulk-Si FinFETs

1/f noise and DLTS of LEDs

1/f noise measurements for faster electromigration characterization

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

10 Gb/s integrated tunable hybrid III-V/Si laser and silicon mach-zehnder modulator

10 Gb/s radio-over-fiber at 28 GHz carrier frequency link based on 1550 nm VCSEL chirp enhanced intensity modulation after 2 km fiber

10 GBd modulator directly driven by an FPGA without elctrical amplification