Browsing by author "Nolmans, Philip"
Now showing items 1-20 of 30
-
84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor
Lin, Hesheng; Velenis, Dimitrios; Nolmans, Philip; Sun, Xiao; Catthoor, Francky; Lauwereins, Rudy; Van der Plas, Geert; Beyne, Eric (2022) -
91.5%-Efficiency fully integrated voltage regulator with 86fF/μm2-high-density 2.5 MIM capacitor
Lin, Hesheng; Velenis, Dimitrios; Nolmans, Philip; Sun, Xiao; Catthoor, Francky; Lauwereins, Rudy; Van der Plas, Geert; Beyne, Eric (2021) -
A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency
Pantano, Nicolas; Van der Plas, Geert; Bex, Pieter; Nolmans, Philip; Velenis, Dimitrios; Verhelst, Marian; Beyne, Eric (2019) -
An electrostatic fringing-field actuator (EFFA): application towards a low-complexity thin-film RF-MEMS technology
Rottenberg, Xavier; Brebels, Steven; Ekkels, Phillip; Czarnecki, Piotr; Nolmans, Philip; Mertens, Robert; Nauwelaers, Bart; Puers, Bob; De Wolf, Ingrid; De Raedt, Walter; Tilmans, Harrie (2007-07) -
Characterization and Reliability Study of an Al-Doped HfO2-Based High-Density 2.5-D MIMCAP
Chery, Emmanuel; Croes, Kristof; Nolmans, Philip; Beyne, Eric (2024) -
Decoupling capacitor integration in passive silicon interposer
Detalle, Mikael; Roda Neve, Cesar; Nolmans, Philip; Miller, Andy; La Manna, Antonio; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2015) -
Effect of substrate charging on the reliability of capacitive RF MEMS switches
Czarnecki, Piotr; Rottenberg, Xavier; Soussan, Philippe; Ekkels, Phillip; Muller, Philippe; Nolmans, Philip; De Raedt, Walter; Tilmans, Harrie; Puers, Bob; Marchand, Laurent; De Wolf, Ingrid (2009) -
Electrostatic fringing-field actuator (EFFA): application towards a low-complexity RF-MEMS technology
Rottenberg, Xavier; Nolmans, Philip; Ekkels, Phillip; Czarnecki, Piotr; Mertens, Robert; Nauwelaers, Bart; De Wolf, Ingrid; De Raedt, Walter; Tilmans, Harrie (2007-01) -
ENDORFINS: Enabling deployment of RF MEMS technology in space telecommunication
Czarnecki, Piotr; Soussan, Philippe; Rottenberg, Xavier; Muller, Philippe; Nolmans, Philip; Ekkels, Phillip; De Raedt, Walter; Tilmans, Harrie; Puers, Bob; Vendier, Olivier; Marchand, Laurent; De Wolf, Ingrid (2007) -
ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications
Suhard, Samuel; Claes, Martine; Civale, Yann; Nolmans, Philip; Sabuncuoglu Tezcan, Deniz (2012) -
ESH solvent for stripping positive and negative photoresists in 3D-WLP and 3D-SIC applications
Suhard, Samuel; Claes, Martine; Civale, Yann; Nolmans, Philip; Sabuncuoglu Tezcan, Deniz; Travaly, Youssef (2010) -
Experimental evidence of non-uniform dielectric charging in capacitive RF-MEMS switches
Czarnecki, Piotr; Rottenberg, Xavier; Soussan, Philippe; Nolmans, Philip; Ekkels, Phillip; Muller, Philippe; Tilmans, Harrie; De Raedt, Walter; Puers, Bob; Marchand, Laurent; De Wolf, Ingrid (2007-09) -
Fat damascene wires for high bandwidth routing in silicon interposer
Detalle, Mikael; Kim, Jaemin; Nolmans, Philip; Sun, Xiao; Ryckaert, Julien; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
Generic RF-MEMS technology platform for mobile and satellite communications
Tilmans, Harrie; Rottenberg, Xavier; Soussan, Philippe; Nolmans, Philip; Ekkels, Phillip; Czarnecki, Piotr; Modlinski, Robert; Stoukatch, Serguei; Jourdain, Anne; Nauwelaers, Bart; Vaesen, Kristof; Carchon, Geert; De Wolf, Ingrid; De Raedt, Walter (2005) -
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
Roda Neve, Cesar; Detalle, Mikael; Nolmans, Philip; Li, Yunlong; De Vos, Joeri; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2016) -
High-speed TSV integration in an active silicon photonics interposer platform
Bogaerts, Lieve; El-Mekki, Zaid; Van Huylenbroeck, Stefaan; Nolmans, Philip; Pantano, Nicolas; Sun, Xiao; Rakowski, Michal; Velenis, Dimitrios; Verheyen, Peter; Balakrishnan, Sadhishkumar; De Heyn, Peter; Ban, Yoojin; Srinivasan, Ashwyn; Lardenois, Sebastien; De Coster, Jeroen; Detalle, Mikael; Absil, Philippe; Miller, Andy; Pantouvaki, Marianna; Van Campenhout, Joris (2018) -
Hybrid 14nm FinFET - Silicon photonics technology for low-power Tb/s/mm2 optical I/O
Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Snyder, Brad; Balakrishnan, Sadhishkumar; Van Huylenbroeck, Stefaan; Bogaerts, Lieve; Demeurisse, Caroline; Inoue, Fumihiro; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Bex, Pieter; Srinivasan, Ashwyn; De Coster, Jeroen; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2018) -
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2017) -
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Redolfi, Augusto; Velenis, Dimitrios; Thangaraju, Sarasvathi; Nolmans, Philip; Jaenen, Patrick; Kostermans, Maarten; Baier, Ulrich; Van Besien, Els; Dekkers, Harold; Witters, Thomas; Jourdan, Nicolas; Van Ammel, Annemie; Vandersmissen, Kevin; Rodet, Simon; Philipsen, Harold; Radisic, Alex; Heylen, Nancy; Travaly, Youssef; Swinnen, Bart; Beyne, Eric (2011-06) -
Influence of the substrate on the lifetime of capacitive RF MEMS switches
Czarnecki, Piotr; Rottenberg, Xavier; Soussan, Philippe; Ekkels, Phillip; Muller, Philippe; Nolmans, Philip; De Raedt, Walter; Tilmans, Harrie; Puers, Bob; Marchand, Laurent; De Wolf, Ingrid (2008-01)