Browsing by author "Cotrin Teixeira, Ricardo"
Now showing items 1-14 of 14
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3D Embedding and interconnection of ultra thin (<20um) silicon dies
Iker, Francois; Sabuncuoglu Tezcan, Deniz; Cotrin Teixeira, Ricardo; Soussan, Philippe; De Moor, Piet; Beyne, Eric; Baert, Kris (2007) -
3D stacked IC demonstration using a through silicon via first approach
Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008) -
Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Iker, Francois; Funaya, Takuo; Cotrin Teixeira, Ricardo; Ruythooren, Wouter (2009) -
Diamond bit cutting for processing high topography wafers
Agarwal, Rahul; Pham, Nga; Cotrin Teixeira, Ricardo; Andrei, Alexandru; Ruythooren, Wouter; Iker, Francois; Soussan, Philippe (2009) -
Die level thinning down to 15μm thickness
Cotrin Teixeira, Ricardo; Torfs, Tom; De Munck, Koen; De Moor, Piet; Baert, Kris; Van Hoof, Chris (2007-12) -
High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
Beyne, Eric; Iker, Francois; Soussan, Philippe; Funaya, Takuo; Vanfleteren, Jan; Cotrin Teixeira, Ricardo; Torfs, Tom; Christiaens, Wim (2008) -
Impact of thinning and packaging on a deep sub-micron CMOS product
Perry, Dan; Ray, Urmi; Gu, Sam; Nakamoto, Mark; Sy, Wing; Wang, Kevin; Ruythooren, Wouter; Yang, Yu; De Wolf, Ingrid; Cotrin Teixeira, Ricardo; Gonzalez, Mario; Simons, Veerle; Berry, Christopher J.; Lee, KiWook; Burggraf, Jürgen; Pargfrieder, Stefan (2009) -
Process induced sub-surface damage in mechanically ground silicon wafers
Yang, Yu; De Munck, Koen; Cotrin Teixeira, Ricardo; Swinnen, Bart; Verlinden, Bert; De Wolf, Ingrid (2008-07) -
Statistical analysis of the influence of thinning processes on the strength of silicon
Yang, Yu; Cotrin Teixeira, Ricardo; Roussel, Philippe; Swinnen, Bart; Verlinden, Bert; De Wolf, Ingrid (2009) -
Stress analysis on ultra thin ground wafers
Cotrin Teixeira, Ricardo; De Munck, Koen; De Moor, Piet; Baert, Kris; Swinnen, Bart; Van Hoof, Chris; Knüttel, Alexsander (2007-09) -
Stress analysis on ultra thin ground wafers
Cotrin Teixeira, Ricardo; De Munck, Koen; De Moor, Piet; Baert, Kris; Swinnen, Bart; Van Hoof, Chris; Knüttel, Alexander (2008) -
The influence of grinding and cleaning on Deep Reactive Ion Etching
Verdonck, Patrick; Van Cauwenberghe, Marc; Phommahaxay, Alain; Jamieson, Geraldine; Bogaerts, Lieve; Cotrin Teixeira, Ricardo; Huyghebaert, Cedric; Tutunjyan, Nina; Bearda, Twan; Boullart, Werner (2009) -
Thickness characterization of ultra thin wafers on carrier
Cotrin Teixeira, Ricardo; De Munck, Koen; Baert, Kris; Swinnen, Bart; Knüttel, Alexsander; De Moor, Piet (2007-12) -
Wafer thinning and planarization tech-nology for 3D Interconnects
Vaes, Jan; Cotrin Teixeira, Ricardo; Swinnen, Bart (2008)