Browsing by author "Van De Peer, Myriam"
Now showing items 1-18 of 18
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A fully packaged electromagnetic microrelay
Tilmans, Harrie; Fullin, E.; Ziad, Hocine; Van De Peer, Myriam; Kesters, J.; Van Geffen, E.; Bergqvist, J.; Pantus, M.; Beyne, Eric; Baert, Kris; Naso, F. (1999) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Cu pumping in TSVs: Effect of pre-CMP thermal budget
De Wolf, Ingrid; Croes, Kristof; Varela Pedreira, Olalla; Labie, Riet; Redolfi, Augusto; Van De Peer, Myriam; Vanstreels, Kris; Okoro, Chukwudi; Vandevelde, Bart; Beyne, Eric (2011) -
Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
Ratchev, Petar; Van De Peer, Myriam; Ho, Meng; Verlinden, B.; Bender, Hugo; De Wolf, Ingrid (2003) -
Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
Nagano, Fuya; Kajihara, Masanori; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Beyer, Gerald (2017) -
Hermetically sealed on-chip packaging of MEMS devices
De Moor, Piet; Tilmans, Harrie; Van De Peer, Myriam; Labie, Riet; Beerten, Steven; Beyne, Eric; Van Hoof, Chris (2000) -
Impact of Cu TSVs on BEOL metal and dielectric reliability
Li, Yunlong; Croes, Kristof; Nabiollahi, Nabi; Van Huylenbroeck, Stefaan; Gonzalez, Mario; Velenis, Dimitrios; Bender, Hugo; Jourdain, Anne; Pantouvaki, Marianna; Stucchi, Michele; Vanstreels, Kris; Van De Peer, Myriam; De Messemaeker, Joke; Wu, Chen; Beyer, Gerald; De Wolf, Ingrid; Beyne, Eric (2014) -
Investigation and characterisation of COB assembly aspects on high power MCM-L substrates
Ackaert, Ann; Vereecken, M.; Forrest, M.; Beyne, Eric; Van De Peer, Myriam (1994) -
Low temperature zero-level hermetic packaging for MEMS based on solder and polymer bonding
De Moor, Piet; Baert, Kris; Du Bois, Bert; Jamieson, Geraldine; Jourdain, Anne; Tilmans, Harrie; Van De Peer, Myriam; Witvrouw, Ann; Van Hoof, Chris (2003) -
Morphology of IMC in the binary systems of Co/Sn and Cu/Sn
Nagano, Fuya; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Kajihara, Masanori; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
New approach to investigate wettability and stability of capping layers on UBMs for 3D stacking applications
Hou, Lin; Derakhshandeh, Jaber; Bex, Pieter; Capuz, Giovanni; Van De Peer, Myriam; Wang, Teng; Houshmand Sharifi, Shamin; De Preter, Inge; Rebibis, Kenneth June; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2017) -
Packaging for MEMS and MST devices: the indent reflow sealing method
Tilmans, Harrie; Van De Peer, Myriam; Beyne, Eric (2000) -
Reliability challenges during different phases of 3D SIC processing
Croes, Kristof; Civale, Yann; Labie, Riet; Li, Yunlong; De Messemaeker, Joke; Vanstreels, Kris; Redolfi, Augusto; Velenis, Dimitrios; Varela Pedreira, Olalla; Van De Peer, Myriam; Cherman, Vladimir; Vandevelde, Bart; Beyne, Eric; De Wolf, Ingrid (2012) -
Temporary protective packaging for optical MEMS
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; Van De Peer, Myriam; De Coster, Jeroen; La Manna, Antonio; Soussan, Philippe; Witvrouw, Ann (2011) -
The indent reflow sealing (IRS) technique - A method for the fabrication of sealed cavities for MEMS devices
Tilmans, Harrie; Van De Peer, Myriam; Beyne, Eric (2000) -
Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability
Wang, Teng; De Messemaeker, Joke; Cherman, Vladimir; Kay, Alvin Chow Chee; Cadacio Jr., Francisco; Matterne, Mireille; Simons, Veerle; Van De Peer, Myriam; Lesniewska, Alicja; Varela Pedreira, Olalla; Gerets, Carine; Rebibis, Kenneth June; Beyne, Eric (2015) -
Zero-level packaging for MEMS or MST devices: the IRS method
Tilmans, Harrie; Van De Peer, Myriam; Beyne, Eric (2000) -
Zero-level packaging for MEMS or MST devices: the IRS method
Tilmans, Harrie; Van De Peer, Myriam; Beyne, Eric (2000)