Browsing by author "Drissi, Youssef"

Now showing items 1-11 of 11

    • 21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization 

      Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019)

    • Design and pitch scaling for affordable node transition and EUV insertion scenario 

      Kim, Ryan Ryoung han; Ryckaert, Julien; Raghavan, Praveen; Sherazi, Yasser; Debacker, Peter; Trivkovic, Darko; Gillijns, Werner; Tan, Ling Ee; Drissi, Youssef; Blanco, Victor; Bekaert, Joost; Mao, Ming; Lariviere, Stephane; McIntyre, Greg (2017)

    • Design, patterning, and process integration overview for 2nm node 

      Sherazi, Yasser; Chang, Yi-Han; Drissi, Youssef; Chehab, Bilal; Vega Gonzalez, Victor; Kim, Ryan Ryoung Han; Lee, Jae Uk (2022)

    • EUV Single Patterning Exploration for Pitch 28 nm 

      Xu, Dongbo; Gillijns, Werner; Drissi, Youssef; Tan, Ling Ee; Oak, Apoorva; Kim, Ryan Ryoung han (2021-02-22)

    • EUV single patterning for logic metal layers: achievement and challenge 

      Kim, Ryan Ryoung han; Gillijns, Werner; Drissi, Youssef; Trivkovic, Darko; Blanco, Victor; Lariviere, Stephane; De Ruyter, Rudi; Dehan, Morin; McIntyre, Greg; Tan, Ling Ee (2017)

    • Imec iSiPP25G silicon photonics: a robust CMOS-based photonics technology platform 

      Absil, Philippe; De Heyn, Peter; Chen, Hongtao; Verheyen, Peter; Lepage, Guy; Pantouvaki, Marianna; De Coster, Jeroen; Khanna, Amit; Drissi, Youssef; Van Thourhout, Dries; Van Campenhout, Joris (2015)

    • Improving Silicon-photonics inverse-design printability by leveraging SEM contours for advanced Optical Proximity Correction techniques 

      Drissi, Youssef; Gillijns, Werner; Lardenois, Sebastien; Verheyen, Peter; Lepage, Guy; Mohsen, Mahmoud; Delorme, Maxence (2022)

    • Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations 

      Vega Gonzalez, Victor; Montero Alvarez, Daniel; Versluijs, Janko; Varela Pedreira, Olalla; Jourdan, Nicolas; Puliyalil, Harinarayanan; Chehab, Bilal; Peissker, Tobias; Haider, Ali; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Le, Quoc Toan; Bazzazian, Nina; Heylen, Nancy; van der Veen, Marleen; El-Mekki, Zaid; Webers, Tomas; Vats, H.; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Gillijns, Werner; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Ciofi, Ivan; De Wachter, Bart; Swerts, Johan; Grieten, Eva; Ercken, Monique; Kim, Ryan Ryoung han; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Nagesh, Nishanth; Ramakers, Leon; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021)

    • Semi-damascene Integration of a 2-layer MOL VHV Scaling Booster to Enable 4-track Standard Cells 

      Vega Gonzalez, Victor; Radisic, Dunja; Choudhury, Subhobroto; Tierno, Davide; Thiam, Arame; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Seidel, Felix; Decoster, Stefan; Kundu, Souvik; Tsvetanova, Diana; Peter, Antony; De Coster, Hanne; Sepulveda Marquez, Alfonso; Altamirano Sanchez, Efrain; Chan, BT; Drissi, Youssef; Sherazi, Yasser; Lee, Jae Uk; Ciofi, Ivan; Murdoch, Gayle; Nagesh, Nishanth; Hellings, Geert; Ryckaert, Julien; Biesemans, Serge; Dentoni Litta, Eugenio; Horiguchi, Naoto; Park, Seongho; Tokei, Zsolt (2022)

    • Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium 

      Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020)

    • Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node 

      Vega Gonzalez, Victor; Wilson, Chris; Briggs, Basoene; Decoster, Stefan; Versluijs, Janko; Lesniewska, Alicja; Paolillo, Sara; Baert, Rogier; Puliyalil, Harinarayanan; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Teugels, Lieve; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Gupta, Anshul; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Debacker, Peter; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Dillemans, Leander; Chen, Yi-Fan; Tokei, Zsolt (2019)