Browsing by author "Prager, Lutz"
Now showing items 1-10 of 10
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Application of UV irradiation in removal of post-etch 193 nm photoresist
Le, Quoc Toan; Kesters, Els; Prager, Lutz; Lux, Marcel; Marsik, Premysl; Vereecke, Guy (2009) -
Effect of pressure on efficiency of UV curing of CVD low-k material at different wavelengths
Prager, Lutz; Naumov, Sergei; Pistol, L.; Wennrich, L.; Buchmeister, M. R.; Marsik, Premysl; Verdonck, Patrick; Baklanov, Mikhaïl (2008) -
Effect of radical scavenger and UV irradiation on removal of photoresist and BARC using water/ozone in Cu/low-k interconnect
Le, Quoc Toan; Lux, Marcel; Kesters, Els; Prager, Lutz; Vereecke, Guy (2009) -
Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films
Redzheb, Murad; Prager, Lutz; Naumov, Sergej; Armini, Silvia; Voort, Pascal Van Der; Krishtab, Mikhail; Baklanov, Mikhaïl (2016) -
Impact of UV wavelength and curing time on the properties of spin-coated low-k films
Redzheb, Murad; Prager, Lutz; Krishtab, Mikhail; Armini, Silvia; Vanstreels, Kris; Franquet, Alexis; Van Der Voort, Pascal; Baklanov, Mikhaïl (2015) -
Modification of 193-nm photoresist by UV irradiation for post-etch wet strip applications
Kesters, Els; Le, Quoc Toan; Lux, Marcel; Prager, Lutz; Vereecke, Guy (2009) -
Modification of photoresist by UV for post-etch wet strip applications
Le, Quoc Toan; Kesters, Els; Prager, Lutz; Claes, Martine; Lux, Marcel; Vereecke, Guy (2009) -
Removal of post-etch 193 nm photoresist in porous low-k dielectric patterning using UV irradiation and wet chemistries
Le, Quoc Toan; Kesters, Els; Prager, Lutz; Lux, Marcel; Vereecke, Guy (2009) -
Removal of post-etch 193-nm photoresist in porous low-k dielectric patterning using UV irradiation and ozonated water
Kesters, Els; Le, Quoc Toan; Lux, Marcel; Prager, Lutz; Vereecke, Guy (2010) -
UV cure of oxycarbosilane low-k films
Redzheb, Murad; Prager, Lutz; Krishtab, Mikhail; Armini, Silvia; Vanstreels, Kris; Franquet, Alexis; Van der Voort, Pascal; Baklanov, Mikhaïl (2016)