Browsing by author "Ratchev, Petar"
Now showing items 21-38 of 38
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Fine pitch copper wire bonding on copper bond pad process optimization
Lam, Kan Wai; Ho, Meng; Stoukatch, Serguei; Ratchev, Petar; Vath, C.J.; Schervan, A.; Beyne, Eric (2002) -
Investigation of Co UBM for direct bumping on Cu/lowK dies
Labie, Riet; Beyne, Eric; Ratchev, Petar (2003) -
Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Ratchev, Petar; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2005) -
Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests
Labie, Riet; Beyne, Eric; Mertens, Robert; Ratchev, Petar; Humbeeck, J.V. (2003-12) -
Lead free solder joint reliability estimation by finite element modelling, advantages, challenges and limitations
Vandevelde, Bart; Gonzalez, Mario; Limaye, Paresh; Ratchev, Petar; Vanfleteren, Jan; Beyne, Eric (2004) -
Long-term consequences of 'Green' electronics not to be forgotten
Snoeckx, Koen; Vandevelde, Bart; Ratchev, Petar (2005-07) -
Mechanical issues of Cu to Cu wire bonding
Chen, Jian; Degryse, Dominiek; Ratchev, Petar; De Wolf, Ingrid (2004-09) -
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
Ratchev, Petar; Stoukatch, Serguei; Swinnen, Bart (2005) -
Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints
Ratchev, Petar; Labie, Riet; Beyne, Eric (2004) -
Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding
Ratchev, Petar; Carbonell, Laure; Ho, Meng; Bender, Hugo; De Wolf, Ingrid; Verlinden, B. (2002) -
Packaging research goes lead-free: a microscopic look on reliability issues
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-10) -
Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish
Ratchev, Petar; Vandevelde, Bart; De Wolf, Ingrid (2004) -
Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish
Ratchev, Petar; Vandevelde, Bart; De Wolf, Ingrid (2003) -
Reliability and failure modes of SnAgCu solder joints for PSGA packages
Ratchev, Petar; Vandevelde, Bart; Gonzalez, Mario; De Wolf, Ingrid (2003) -
Reliability of RF-MEMS: stress relaxation in Al-alloy films
Modlinski, Robert; Chen, Q.; Witvrouw, Ann; Ratchev, Petar; Puers, Bob; den Toonder, J.M.J.; De Wolf, Ingrid (2003) -
Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages,
Vandevelde, Bart; Gonzalez, Mario; Limaye, Paresh; Ratchev, Petar; Beyne, Eric (2007) -
Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison of for several IC-packages
Vandevelde, Bart; Gonzalez, Mario; Limaye, Paresh; Ratchev, Petar; Beyne, Eric (2004-05) -
Zuverlassigkeit bleifreier Lotstellen
Snoeckx, Koen; Vandevelde, Bart; Ratchev, Petar (2005-04)