Browsing by author "Katti, Guruprasad"

3-D technology assessment: path-finding the technology/design sweet-spot

Marchal, Pol; Bougard, Bruno; Katti, Guruprasad; Stucchi, Michele; Dehaene, Wim; Papanikolaou, Antonis; Verkest, Diederik; Swinnen, Bart; Beyne, Eric (2009)

3D stacked IC demonstration using a through silicon via first approach

Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008)

3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)

Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009)

3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009)

3D technology roadmap and status

Marchal, Pol; Van der Plas, Geert; Eneman, Geert; Moroz, V.; Badaroglu, Mustafa; Mercha, Abdelkarim; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Stucchi, Michele; Vandevelde, Bart; Oprins, Herman; Cherman, Vladimir; Croes, Kris; Redolfi, Augusto; La Manna, Antonio; Travaly, Youssef; Beyne, Eric; Cartuyvels, Rudi (2011)

Capacitance measurements of 2-dimensional and 3-dimensional IC interconnect structures by quasi-static C-V technique

Stucchi, Michele; Velenis, Dimitrios; Katti, Guruprasad (2012)

Capacitance reduction technique for through silicon via (TSV) in p-Si substrate

Katti, Guruprasad; Stucchi, Michele; De Meyer, Kristin; Dehaene, Wim (2010)

Characterization and modeling of through silicon via (TSV) and its impact on 3D circuits and systems

Katti, Guruprasad (2011-11)

Design, verification and simulation of 3D circuit

Katti, Guruprasad; De Wachter, Bart; Nelis, Marc; Dehan, Morin; Cupak, Miroslav; Croes, Kris; Beeckman, Gerd; Marchal, Pol; Stucchi, Michele (2009)

Electrical modeling and characterization of through silicon via for three-dimensional ICs

Katti, Guruprasad; Stucchi, Michele; De Meyer, Kristin; Dehaene, Wim (2010)

Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance

Mercha, Abdelkarim; Redolfi, Augusto; Stucchi, Michele; Minas, Nikolaos; Van Olmen, Jan; Thangaraju, Sarasvathi; Velenis, Dimitrios; Domae, Shinichi; Yang, Yu; Katti, Guruprasad; Labie, Riet; Okoro, Chukwudi; Zhao, Ming; Asimakopoulos, Panagiotis; De Wolf, Ingrid; Chiarella, Thomas; Schram, Tom; Rohr, Erika; Van Ammel, Annemie; Jourdain, Anne; Ruythooren, Wouter; Armini, Silvia; Radisic, Alex; Philipsen, Harold; Heylen, Nancy; Kostermans, Maarten; Jaenen, Patrick; Sleeckx, Erik; Sabuncuoglu Tezcan, Deniz; Debusschere, Ingrid; Soussan, Philippe; Perry, Dan; Van der Plas, Geert; Cho, Jong Hoon; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010)

Technology assessment of through-silicon via by using C-V and C-t Measurements

Katti, Guruprasad; Stucchi, Michele; Velenis, Dimitrios; Thangaraju, Sarasvathi; De Meyer, Kristin; Dehaene, Wim; Beyne, Eric (2011)

Temperature dependent electrical characteristics of through-si-via (TSV) interconnections

Katti, Guruprasad; Mercha, Abdelkarim; Stucchi, Michele; Tokei, Zsolt; Velenis, Dimitrios; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Oprins, Herman; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010)

Temperature-dependent modeling and characterization of Through Silicon Via (TSV) capacitance

Katti, Guruprasad; Stucchi, Michele; Velenis, Dimitrios; Soree, Bart; De Meyer, Kristin; Dehaene, Wim (2011)

Test structures for characterization of through silicon vias

Stucchi, Michele; Perry, Dan; Katti, Guruprasad; Dehaene, Wim (2010)

Test structures for characterization of through-silicon vias

Stucchi, Michele; Perry, Daniel; Katti, Guruprasad; Dehaene, Wim; Velenis, Dimitrios (2012)

TSV characterization and modeling

Stucchi, Michele; Katti, Guruprasad; Velenis, Dimitrios (2011)

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions

Van der Plas, Geert; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Limaye, Paresh; Mercha, Abdelkarim; Stucchi, Michele; Oprins, Herman; Vandevelde, Bart; Minas, Nikolaos; Cupak, Miroslav; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Beyne, Eric; Marchal, Pol (2010-09)