Browsing by author "Zhang, Wenqi"
Now showing items 1-20 of 54
-
3D
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Beyne, Eric; Soussan, Philippe (2011) -
3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring
Zhang, Wenqi; Majeed, Bivragh; Sun, Xiao; Posada Quijano, Guillermo; Diekmann, C.; Eggs, C.; Schmidhammer, E.; De Raedt, Walter (2011) -
3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance
Sun, Xiao; Posada Quijano, Guillermo; Majeed, Bivragh; Zhang, Wenqi; De Raedt, Walter; Diekmann, C.; Eggs, C.; Schmidhammer, E. (2011) -
3D stacking using ultra thin dies
La Manna, Antonio; Velenis, Dimitrios; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Zhang, Wenqi; Beyne, Eric (2012) -
3D system integration - opportunities and challenges
Zhang, Wenqi; Beyne, Eric (2011) -
3D technology enabling innovative smart system integration
Beyne, Eric; Zhang, Wenqi (2011) -
Analysis of microbump induced stress effects in 3D stacked IC technologies
Ivankovic, Andrej; Van der Plas, Geert; Moroz, V.; Choi, M.; Cherman, Vladimir; Mercha, Abdelkarim; Marchal, Pol; Gonzalez, Mario; Eneman, Geert; Zhang, Wenqi; Buisson, Thibault; Detalle, Mikael; La Manna, Antonio; Verkest, Diederik; Beyer, Gerald; Beyne, Eric; Vandevelde, Bart; De Wolf, Ingrid; Vandepitte, Dirk (2012) -
Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity
Zhang, Wenqi; Brongersma, Sywert; Li, Zhen; Li, dagang; Richard, Olivier; Maex, Karen (2007) -
Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices
La Manna, Antonio; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Velenis, Dimitrios; Zhang, Wenqi; Beyne, Eric (2012-06) -
Characterization of oxidation of the electroplated Sn for advanced flip-chip bonding
Zhang, Wenqi; Ruythooren, Wouter (2009) -
Continued scalability of copper/low-k interconnects
Brongersma, Sywert; Carbonell, Laure; Vanstreels, Kris; Iacopi, Francesca; D'Haen, Jan; Zhang, Wenqi; Travaly, Youssef; Demuynck, Steven; Tokei, Zsolt; De Ceuninck, Ward; Maex, Karen (2005) -
Copper grain growth in reduced dimensions
Brongersma, Sywert; Vanstreels, Kris; Wu, W.; Zhang, Wenqi; Ernur, Didem; D'Haen, Jan; Terzieva, Valentina; Van Hove, Marleen; Clarysse, Trudo; Carbonell, Laure; Vandervorst, Wilfried; De Ceuninck, Ward; Maex, Karen (2004-06) -
Cu/Sn microbumps interconnect for 3D TSV chip stacking
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010) -
Dependence of energy distributions of interface states on stress conditions
Zhang, Wenqi; Zhang, Jenny; Uren, M. J.; Groeseneken, Guido; Degraeve, Robin; Lalor, M.; Burton, D. (2001) -
Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration
Zhang, Wenqi; Limaye, Paresh; Civale, Yann; Labie, Riet; Soussan, Philippe (2010) -
Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization
Zhang, Wenqi; La Manna, Antonio; Soussan, Philippe; Beyne, Eric (2012) -
Fine pitch micro-bump interconnections for advanced 3D chip stacking
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Soussan, Philippe (2011) -
Formation of compounds and Kirkendall vacancy in the Cu-Sn system
O, Minho; Vakanas, George; Moelans, Nele; Kajihara, Masanori; Zhang, Wenqi (2014) -
Geometry effect on impurity incorporation and grain growth in narrow copper lines
Zhang, Wenqi; Brongersma, Sywert; Heylen, Nancy; Beyer, Gerald; Vandervorst, Wilfried; Maex, Karen (2005) -
High density 20μm pitch CuSn microbump process for high-end 3D applications
De Vos, Joeri; Jourdain, Anne; Erismis, Mehmet Akif; Zhang, Wenqi; De Munck, Koen; La Manna, Antonio; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2011)