Browsing by author "Mercha, Abdelkarim"
Now showing items 1-20 of 264
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1/f low frequency fluctuations and inversion layer quantization in deep submicron metal-oxide-semiconductor field effect transistors
Mercha, Abdelkarim; Simoen, Eddy; Claeys, Cor (2002) -
3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012) -
3D Integration: Circuit design, test and reliability challenges
Minas, Nikolaos; De Wolf, Ingrid; Marinissen, Erik Jan; Stucchi, Michele; Oprins, Herman; Mercha, Abdelkarim; Van der Plas, Geert; Velenis, Dimitrios; Marchal, Pol (2010) -
3D interconnect and packaging technology
Mercha, Abdelkarim (2011) -
3D stacked IC demonstration using a through silicon via first approach
Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008) -
3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)
Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009) -
3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding
Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009) -
3D technology roadmap and status
Marchal, Pol; Van der Plas, Geert; Eneman, Geert; Moroz, V.; Badaroglu, Mustafa; Mercha, Abdelkarim; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Stucchi, Michele; Vandevelde, Bart; Oprins, Herman; Cherman, Vladimir; Croes, Kris; Redolfi, Augusto; La Manna, Antonio; Travaly, Youssef; Beyne, Eric; Cartuyvels, Rudi (2011) -
45nm planar bulk CMOS 23GHz LNA with above IC inductors
Wen-Chieh, Wang; Zue-Der, Huang; Carchon, Nadine; Mercha, Abdelkarim; Decoutere, Stefaan; De Raedt, Walter; Chung-Yu, Wu (2010) -
90nm RF CMOS technology for low-power 900MHz applications
Ramos, Javier; Mercha, Abdelkarim; Jeamsaksiri, Wutthinan; Linten, Dimitri; Jenei, Snezana; Rooyackers, Rita; Verbeeck, Rita; Thijs, Steven; Scholten, Andries; Wambacq, Piet; Debusschere, Ingrid; Decoutere, Stefaan (2004) -
A 1 V 23 GHz low-noise amplifier in 45 nm planar bulk-CMOS technology with high-Q above-IC inductors
Wang, W.C.; Huang, Z.D.; Carchon, Geert; Mercha, Abdelkarim; Decoutere, Stefaan; De Raedt, Walter; Wu, C.Y. (2009) -
A 10-bit current-steering FinFET D/A converter
Fulde, Michael; Kuttner, F.; von Armin, Klaus; Parvais, Bertrand; Mercha, Abdelkarim; Collaert, Nadine; Rooyackers, Rita; Becherer, M.; Schmitt-Landsiedel, D.; Knoblinger, G. (2008) -
A 20GHz sub-1V low noise amplifier and a resistive mixer in 90nm CMOS technology
Bao, M.; Jacobsson, Harald; Aspemyr, Lars; Mercha, Abdelkarim; Carchon, Geert (2005-12) -
A 328 uW5 GHz voltage-controlled oscillator in 90 nm CMOS with high-quality thin-film post-processed inductor
Linten, Dimitri; Sun, Xiao; Carchon, Geert; Jeamsaksiri, Wutthinan; Mercha, Abdelkarim; Ramos, Javier; Jenei, Snezana; Aspemyr, Lars; Scholten, Andries; Wambacq, Piet; Decoutere, Stefaan; Donnay, Stephane; De Raedt, Walter (2004-06) -
A 5 GHz fully integrated ESD-protected low-noise amplifier in 90 nm RF CMOS
Linten, Dimitri; Thijs, Steven; Mahadeva Iyer, Natarajan; Wambacq, Piet; Jeamsaksiri, Wutthinan; Ramos, Javier; Mercha, Abdelkarim; Jenei, Snezana; Donnay, Stephane; Decoutere, Stefaan (2004-09) -
A 5 GHz fully integrated ESD-protected low-noise amplifier in 90 nm RF CMOS
Linten, Dimitri; Thijs, Steven; Mahadeva Iyer, Natarajan Mahadeva Iyer; Wambacq, Piet; Jeamsaksiri, Wutthinan; Ramos, Javier; Mercha, Abdelkarim; Jenei, Snezana; Decoutere, Stefaan; Donnay, Stephane (2005-06) -
A 90nm RF CMOS technology supported by device modelling and circuit demonstrators
Ramos, Javier; Mercha, Abdelkarim; Jeamsaksiri, Wutthinan; Linten, Dimitri; Jenei, Snezana; Thijs, Steven; Scholten, Andries; Wambacq, Piet; Debusschere, Ingrid; Decoutere, Stefaan (2004) -
A comprehensive benchmark and optimization of 5-nm lateral and vertical GAA 6T-SRAMs
Huynh Bao, Trong; Sakhare, Sushil; Yakimets, Dmitry; Ryckaert, Julien; Thean, Aaron; Mercha, Abdelkarim; Verkest, Diederik; Wambacq, Piet (2016) -
A digital intensive circuit for low-frequency noise monitoring in 28nm CMOS
Parvais, Bertrand; Wambacq, Piet; Mercha, Abdelkarim; Verkest, Diederik; Thean, Aaron; Hammo, Hiroaki; Oishi, Tetsuya; Sawada, Ken; Nomoto, Kazuki (2015) -
A low cost 90nm RF-CMOS platform for record RF circuit performance
Jeamsaksiri, Wutthinan; Linten, Dimitri; Thijs, Steven; Carchon, Geert; Ramos, Javier; Mercha, Abdelkarim; Sun, Xiao; Soussan, Philippe; Dehan, Morin; Chiarella, Thomas; Venegas, Rafael; Subramanian, Vaidy; Scholten, A.; Wambacq, Piet; Velghe, Rudolf; Mannaert, Geert; Heylen, Nancy; Verbeeck, Rita; Boullart, Werner; Heyvaert, Ilse; Mahadeva Iyer, Natarajan; Groeseneken, Guido; Debusschere, Ingrid; Biesemans, Serge; Decoutere, Stefaan (2005-06)