Browsing by author "Yang, Liu"
Now showing items 1-14 of 14
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Bottom-up filling of through-silicon vias due to suppressor desorption
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Copper plating uniformity on resistive substrate with segmented anode
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Height uniformity of micro-bumps electroplated on thin Cu seed layers
Yang, Liu; Slabbekoorn, John; Honore, Mia; Stiers, Karen; Struyf, Herbert; Vereecken, Philippe; Radisic, Alex (2016) -
Height uniformity of micro-bumps electroplated on thin Cu seed layers
Yang, Liu; Slabbekoorn, John; Honore, Mia; Stiers, Karen; Struyf, Herbert; Vereecken, Philippe; Radisic, Alex (2016) -
Modeling the bottom-up filling of through-silicon vias through suppressor adsorption/desorption mechanism
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang, Liu; Radisic, Alex; Nagar, Magi; Deconinck, Johan; Leunissen, Peter; Vereecken, Philippe; West, Alan (2012-10) -
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang, Liu; Radisic, Alex; Nagar, Magi; Deconinck, Johan; Vereecken, Philippe; West, Alan (2012) -
Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces
Philipsen, Harold; Jehoul, Hannes; Inoue, Fumihiro; Vandersmissen, Kevin; Yang, Liu; Struyf, Herbert; van Dorp, Dennis (2017) -
Role of oxygen and cuprous ions in copper electroplating
Yang, Liu; Marchal, Wouter; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013-03) -
Stochastic modeling of polyethylene glycol as a suppressor in copper electroplating
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2014) -
The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model
Radisic, Alex; Yang, Liu; Drijbooms, Chris; Bender, Hugo (2012) -
The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model chemistry
Radisic, Alex; Yang, Liu; Drijbooms, Chris; Bender, Hugo (2011) -
The limitation and optimization of bottom-up growth mode in through silicon via electroplating
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2015) -
Wafer-scale Cu plating uniformity on thin Cu seed layers
Yang, Liu; Atanasova, Tanya; Radisic, Alex; Deconinck, Johan; West, Alan; Vereecken, Philippe (2013)