Browsing by author "Pham, Nga"
Now showing items 1-20 of 31
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111-V-on-silicon nitride narrow-linewidth tunable laser based on micro -transfer printing
Pan, Biwei; Bourderionnet, Jerome; Billault, Vincent; Brignon, Arnaud; Dwivedi, Sarvagya Paavan; Dahlem, Marcus; Cummins, Cian; Seema Saseendran, Sandeep; Pham, Nga; Helin, Philippe; Vaissiere, Nicolas; Neel, Delphine; Ramirez, Joan; Decobert, Jean; Rimboeck, Johanna; Loi, Ruggero; Fecioru, Alin; Soltanian, Emad; Zhang, Jing; Kuyken, Bart; Roelkens, Gunther (2023) -
3D integration technology using W2W direct bonding and TSV
Pham, Nga; Sabuncuoglu Tezcan, Deniz; Jamieson, Geraldine; Tutunjyan, Nina; Peng, Lan; Volkaerts, Danny (2015) -
A capacitive humidity sensor using a positive photosensitive polymer
Pham, Nga; Cherman, Vladimir; Duval, Fabrice; Sabuncuoglu Tezcan, Deniz; Jansen, Roelof; Tilmans, Harrie (2010) -
A descum review for cleaning surfaces in polymer embedded process flows
Jamieson, Geraldine; Iker, Francois; Takeshi, Kita; Duval, Fabrice; Pham, Nga; Gerets, Carine; Boullart, Werner; Funaya, T. (2010) -
A versatile LPCVD silicon nitride platform for heterogenous photonic circuits: Ultra tight thickness control and low propagation loss
Helin, Philippe; Firrincieli, Andrea; Ray Chaudhuri, Ashesh; Pham, Nga; Lenci, Silvia; Mannarino, Manuel; Osman, Haris (2019) -
Design of RF feedthroughs in Zero-level packaging for RF MEMS implementing TSVs
El Gannudi, Hamza; Cherman, Vladimir; Farinelli, Paola; Pham, Nga; Bogaerts, Lieve; Tilmans, Harrie; Sorrentino, Roberto (2011) -
Diamond bit cutting for processing high topography wafers
Agarwal, Rahul; Pham, Nga; Cotrin Teixeira, Ricardo; Andrei, Alexandru; Ruythooren, Wouter; Iker, Francois; Soussan, Philippe (2009) -
Highly Selective Color Filters Based on Hybrid Plasmonic-Dielectric Nanostructures
De Proft, Anabel; Lodewijks, Kristof; Figeys, Bruno; Kouznetsov, Dmitry; Verellen, Niels; Pham, Nga; Vereecke, Bart; Sabuncuoglu Tezcan, Deniz; Jansen, Roelof; Van Dorpe, Pol; Rottenberg, Xavier (2022) -
Integration of capillary self-alignment for Face to Face micro bump bonding
Pham, Nga; Daily, Robert; Armini, Silvia; Delande, Tinne; Pantouvaki, Marianna; Soussan, Philippe (2013-09) -
Lithography for patterning inside through-Si vias
Pham, Nga; Sabuncuoglu Tezcan, Deniz; Majeed, Bivragh; De Moor, Piet; Baert, Kris; Swinnen, Bart; Ruythooren, Wouter (2007) -
MEMS packaging and reliability: An undividable couple
Tilmans, Harrie; De Coster, Jeroen; Helin, Philippe; Cherman, Vladimir; Jourdain, Anne; De Moor, Piet; Vandevelde, Bart; Pham, Nga; Zekry, Joseph; Witvrouw, Ann; De Wolf, Ingrid (2012) -
Metal-bonded, hermetic 0-level package for MEMS
Pham, Nga; Limaye, Paresh; Czarnecki, Piotr; Varela Pedreira, Olalla; Cherman, Vladimir; Sabuncuoglu Tezcan, Deniz; Tilmans, Harrie (2010) -
Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules
Posada Quijano, Guillermo; Carchon, Geert; Soussan, Philippe; Pham, Nga; Majeed, Bivragh; Sabuncuoglu Tezcan, Deniz; Ruythooren, Wouter; Nauwelaers, Bart; De Raedt, Walter; Beyne, Eric (2007-11) -
Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias
Posada Quijano, Guillermo; Carchon, Geert; Soussan, Philippe; Pham, Nga; Majeed, Bivragh; Sabuncuoglu Tezcan, Deniz; Ruythooren, Wouter; Nauwelaers, Bart; De Raedt, Walter (2007) -
New CMP challenges at imec
Teugels, Lieve; Korner, Manuela; Heylen, Nancy; Pham, Nga; Leunissen, Peter (2012) -
Parylene N as a dielectric material for through silicon vias
Majeed, Bivragh; Pham, Nga; Sabuncuoglu Tezcan, Deniz; Beyne, Eric (2008) -
Performance and perspectives of 0-level MEMS chip packages with vertical interconnects
Cherman, Vladimir; Pham, Nga; Slabbekoorn, John; Faes, Alessandro; Margesin, Benno; Tilmans, Harrie (2014) -
Photoresist coating and patterning for through-silicon via technology
Pham, Nga; Sabuncuoglu Tezcan, Deniz; Ruythooren, Wouter; De Moor, Piet; Majeed, Bivragh; Baert, Kris; Swinnen, Bart (2008) -
Post processing of a SiNy-based photonic stack above a CMOS imager sensor
Pham, Nga; Tyagi, Hemant Kumar; Du Bois, Bert; Van Hoof, Rita; Winderickx, Gillis; Sabuncuoglu Tezcan, Deniz; Tilmans, Harrie (2018) -
Process challenges in 0-level packaging using 100μm thin chip capping with TSV
Pham, Nga; Cherman, Vladimir; Tutunjyan, Nina; Teugels, Lieve; Sabuncuoglu Tezcan, Deniz; Tilmans, Harrie (2012)