Browsing by author "Gerets, Carine"
Now showing items 21-40 of 41
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Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
Derakhshandeh, Jaber; Beyne, Eric; Beyer, Gerald; Capuz, Giovanni; Cherman, Vladimir; De Preter, Inge; Gerets, Carine; Shafahian, Ehsan; Kennes, Koen; Jamieson, Geraldine; Cochet, Tom; Webers, Tomas; Tobback, Bert; Van der Plas, Geert; La Tulipe, Douglas Charles; Phommahaxay, Alain; Miller, Andy (2022) -
Microbump development on small bump pitch (50μm and lower)
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012) -
Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling
Derakhshandeh, Jaber; Beyne, Eric; Capuz, Giovanni; Inoue, Fumihiro; Cherman, Vladimir; De Preter, Inge; Duval, Fabrice; Slabbekoorn, John; Gerets, Carine; Heyvaert, Cindy; Beirnaert, Filip; Cochet, Tom; Bex, Pieter; Hou, Lin; Lofrano, Melina; Jamieson, Geraldine; Heylen, Nancy; Suhard, Samuel; Honore, Mia; Webers, Tomas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald (2019) -
Picking large thinned dies with high topography on both sides
Gerets, Carine; Derakhshandeh, Jaber; Wang, Teng; Capuz, Giovanni; Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Process development and characterization of 3D multi-die stacking
Gerets, Carine; Derakhshandeh, Aber; Bex, Pieter; Lofrano, Melina; Cherman, Vladimir; Fodor, Ferenc; De Wolf, Ingrid; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric (2020) -
Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012-12) -
Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
Cadacio Jr., Francisco; Rebibis, Kenneth June; Capuz, Giovanni; Daily, Robert; Gerets, Carine; Duval, Fabrice; Wang, Teng; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
SAMs (self-assembled monolayers) passivation of Cobalt microbumps for 3D applications
Hou, Lin; Derakhshandeh, Jaber; Armini, Silvia; Gerets, Carine; De Preter, Inge; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyne, Eric (2015) -
Small pitch micro-bumping and experimental investigation for under filling 3D stacking
La Manna, Antonio; Rebibis, Kenneth June; De Vos, Joeri; Bogaerts, Lieve; Gerets, Carine; Beyne, Eric (2012-09) -
Surface treatment to enable low temperature and pressure copper direct bonding
Dubey, Vikas; Derakhshandeh, Jaber; Beyne, Eric; Gerets, Carine; Cooper, E.; Laermans, Patrick; De Leersnijder, Koen; Baumans, Kim; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid (2016) -
TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps
Gerets, Carine; Derakhshandeh, Jaber; Bex, Pieter; Lofrano, Melina; Cherman, Vladimir; Cochet, Tom; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric (2018) -
Temporary 0-level MEMS packaging using a heat decomposable sealing ring
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; De Coster, Jeroen; Soussan, Philippe; Witvrouw, Ann; Beernaert, Roel; Rudra, Sukumar (2011) -
Temporary protective packaging for optical MEMS
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; Van De Peer, Myriam; De Coster, Jeroen; La Manna, Antonio; Soussan, Philippe; Witvrouw, Ann (2011) -
Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability
Wang, Teng; De Messemaeker, Joke; Cherman, Vladimir; Kay, Alvin Chow Chee; Cadacio Jr., Francisco; Matterne, Mireille; Simons, Veerle; Van De Peer, Myriam; Lesniewska, Alicja; Varela Pedreira, Olalla; Gerets, Carine; Rebibis, Kenneth June; Beyne, Eric (2015) -
Thermal management and processing optimization for 3D multi-layer stacked IC's
Lofrano, Melina; Cherman, Vladimir; Gerets, Carine; Bex, Pieter; Beyne, Eric (2019) -
Transient analysis based thermal characterization of die-die interfaces in 3D-ICs
Oprins, Herman; Cherman, Vladimir; Rebibis, Kenneth June; Vermeersch, Kristina; Gerets, Carine; Vandevelde, Bart; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012-05) -
UBM and solder metallurgy selection for fine pitch 3D stacking
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Underfill material screening and process characterization for 3D stacking
Rebibis, Kenneth June; La Manna, Antonio; Gerets, Carine; Beyne, Eric; Daily, Robert; Capuz, Giovanni (2012) -
Use of Wafer Applied Under Fill for 3D Stacking
La Manna, Antonio; Rebibis, Kenneth June; Gerets, Carine; Beyne, Eric (2011) -
Use of wafer applied underfill for 3D stacking
La Manna, Antonio; Rebibis, Kenneth June; Gerets, Carine; Beyne, Eric (2012)