Recently added

Lead-halide perovskites meet donor-acceptor charge-transfer complexes

Marchal, Nadège; Van Gompel, Wouter; Gélvez-Rueda, Maria C.; Vandewal, Koen; Van Hecke, Kristof; Boyen, Hans-Gerd; Conings, Bert; Herckens, Roald; Maheshwari, Sudeep; Lutsen, Laurence; Quarti, Claudio; Grozema, Ferdinand; Vanderzande, Dirk; Beljonne, David (2019)

Trigger-when-charged: a technique for directly measuring RTN and BTI-induced threshold voltage fluctuation under use-Vdd

Manut, Azrif; Gao, Rui; Zhang, Jian Fu; Ji, Zhigang; Mehedi, Mehzabeen; Zhang, Wei Dong; Vigar, David; Asenov, Asen; Kaczer, Ben (2019)

Smart Reconfigurable photovoltaic modules for Building Integrated PhotoVoltaic applications

Manganiello, Patrizio (2019)

Performance evaluation of backside emitting O-band grating couplers for 100- $l m-thick silicon photonics interposers

Mangal, Nivesh; Missinne, Jeroen; Van Steenberge, Geert; Van Campenhout, Joris; Snyder, Brad (2019)

Detecting carotid stenosis from skin vibrations using laser doppler vibrometry-an in vitro proof-of-concept

Mancini, Viviana; Tommasin, Daniela; Li, YanLu; Reeves, Jonathan; Baets, Roel; Greenwald, Steve; Segers, Patrick (2019-06)

Effect pf substrate roughness on the nucleation and growth behavior of microwave plasma enhanced CVD diamond films

Mallik, Awadesh; Mary Joy, Rani; Rouzbahani Bayatani, Rozita; Lloret, Fernando; Pobedinskas, Paulius; Haenen, Ken (2019)

Economics of semiconductor scaling – a cost analysis for advanced technology node

Mallik, Arindam; Ryckaert, Julien; Kim, Ryan Ryoung han; Debacker, Peter; Decoster, Stefan; Lazzarino, Frederic; Ritzenthaler, Romain; Horiguchi, Naoto; Verkest, Diederik; Mocuta, Anda (2019)

Organic photolithography for displays with integrated fingerprint scanner

Malinowski, Pawel; Ke, Tung Huei; Akkerman, Hylke; Nakamura, Atsushi; Shanmugam, Santhosh; Van Breemen, Albert; Vander Velpen, Dieter; Vandenplas, Erwin; Moreno Hagelsieb, Luis; Verschueren, Lynn; Genoe, Jan; Dehaene, Wim; Kronemeier, Auke Jisk; Steudel, Soeren; Gelinck, Gerwin; Heremans, Paul (2019)

NIR/SWIR monolithic image sensors enabled by thin-film photodiode stacks

Malinowski, Pawel; Georgitzikis, Epimitheas; Li, Yunlong; Boulenc, Pierre; Frazzica, Fortunato; Cavaco, Celso; Guerrieri, Stefano; Maes, Jorick; Hens, Zeger; Gielen, Sam; Verstraeten, Frederik; Verstappen, Pieter; Maes, Wouter; Heremans, Paul; Cheyns, David (2019)

Building low-cost infrared sensors with sub-micron films

Malinowski, Pawel (2019)

Thin-film image sensors and integration into displays

Malinowski, Pawel (2019)

Developments in thin film photodiode based imagers enabling near-infrared imaging

Malinowski, Pawel (2019)

Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging

Malainou, Antonia; Sabuncuoglu Tezcan, Deniz (2019)

EPIC: Efficient Private Image Classification (or: Learning from the Masters)

Makri, E.; Rotaru, D.; Smart, N.P.; Vercauteren, F. (2019)

Journal first presentation of a comparative study of workflow customization strategies: Quality implications for multi-tenant SaaS

Makki, M.; Van Landuyt, D.; Lagaisse, B.; Joosen, Wouter (2019)

imec Publications: Recent submissions

Lead-halide perovskites meet donor-acceptor charge-transfer complexes

Trigger-when-charged: a technique for directly measuring RTN and BTI-induced threshold voltage fluctuation under use-Vdd

Smart Reconfigurable photovoltaic modules for Building Integrated PhotoVoltaic applications

Performance evaluation of backside emitting O-band grating couplers for 100- $l m-thick silicon photonics interposers

Detecting carotid stenosis from skin vibrations using laser doppler vibrometry-an in vitro proof-of-concept

Effect pf substrate roughness on the nucleation and growth behavior of microwave plasma enhanced CVD diamond films

Economics of semiconductor scaling – a cost analysis for advanced technology node

Organic photolithography for displays with integrated fingerprint scanner

NIR/SWIR monolithic image sensors enabled by thin-film photodiode stacks

Building low-cost infrared sensors with sub-micron films

Thin-film image sensors and integration into displays

Developments in thin film photodiode based imagers enabling near-infrared imaging

Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging

EPIC: Efficient Private Image Classification (or: Learning from the Masters)

Journal first presentation of a comparative study of workflow customization strategies: Quality implications for multi-tenant SaaS

The refined EUVL mask model

On correlation between hot-carrier stress induced device parameter degradation and time-zero variability

Bi-modal variability of nFinFET characteristics during hot-carrier stress: a modeling approach

Stochastic modeling of hot-carrier degradation in nFinFETs considering the impact of random traps and random dopants

Stochastic modeling of the impact of random dopants on hot-carrier degradation in n-FinFETs

imec Publications: Recent submissions

Lead-halide perovskites meet donor-acceptor charge-transfer complexes ﻿

Trigger-when-charged: a technique for directly measuring RTN and BTI-induced threshold voltage fluctuation under use-Vdd ﻿

Smart Reconfigurable photovoltaic modules for Building Integrated PhotoVoltaic applications ﻿

Performance evaluation of backside emitting O-band grating couplers for 100- $l m-thick silicon photonics interposers ﻿

Detecting carotid stenosis from skin vibrations using laser doppler vibrometry-an in vitro proof-of-concept ﻿

Effect pf substrate roughness on the nucleation and growth behavior of microwave plasma enhanced CVD diamond films ﻿

Economics of semiconductor scaling – a cost analysis for advanced technology node ﻿

Organic photolithography for displays with integrated fingerprint scanner ﻿

NIR/SWIR monolithic image sensors enabled by thin-film photodiode stacks ﻿

Building low-cost infrared sensors with sub-micron films ﻿

Thin-film image sensors and integration into displays ﻿

Developments in thin film photodiode based imagers enabling near-infrared imaging ﻿

Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging ﻿

EPIC: Efficient Private Image Classification (or: Learning from the Masters) ﻿

Journal first presentation of a comparative study of workflow customization strategies: Quality implications for multi-tenant SaaS ﻿

The refined EUVL mask model ﻿

On correlation between hot-carrier stress induced device parameter degradation and time-zero variability ﻿

Bi-modal variability of nFinFET characteristics during hot-carrier stress: a modeling approach ﻿

Stochastic modeling of hot-carrier degradation in nFinFETs considering the impact of random traps and random dopants ﻿

Stochastic modeling of the impact of random dopants on hot-carrier degradation in n-FinFETs ﻿

Lead-halide perovskites meet donor-acceptor charge-transfer complexes

Trigger-when-charged: a technique for directly measuring RTN and BTI-induced threshold voltage fluctuation under use-Vdd

Smart Reconfigurable photovoltaic modules for Building Integrated PhotoVoltaic applications

Performance evaluation of backside emitting O-band grating couplers for 100- $l m-thick silicon photonics interposers

Detecting carotid stenosis from skin vibrations using laser doppler vibrometry-an in vitro proof-of-concept

Effect pf substrate roughness on the nucleation and growth behavior of microwave plasma enhanced CVD diamond films

Economics of semiconductor scaling – a cost analysis for advanced technology node

Organic photolithography for displays with integrated fingerprint scanner

NIR/SWIR monolithic image sensors enabled by thin-film photodiode stacks

Building low-cost infrared sensors with sub-micron films

Thin-film image sensors and integration into displays

Developments in thin film photodiode based imagers enabling near-infrared imaging

Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging

EPIC: Efficient Private Image Classification (or: Learning from the Masters)

Journal first presentation of a comparative study of workflow customization strategies: Quality implications for multi-tenant SaaS

The refined EUVL mask model

On correlation between hot-carrier stress induced device parameter degradation and time-zero variability

Bi-modal variability of nFinFET characteristics during hot-carrier stress: a modeling approach

Stochastic modeling of hot-carrier degradation in nFinFETs considering the impact of random traps and random dopants

Stochastic modeling of the impact of random dopants on hot-carrier degradation in n-FinFETs