Browsing Conference contributions by imec author "1a00bb760e20c5ca0608491087a61c9d19f6d8e8"
Now showing items 41-60 of 71
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Line-edge roughness reduction and CD slimming using hardback processing
Peters, R.D.; Lucas, K.; Cobb, J.L.; Parker, C.; Patterson, K.; McCauley, R.; Ercken, Monique; Van Roey, Frieda; Vandenbroeck, Nadia; Pollentier, Ivan (2003) -
Matching simulation and experiment for chemically amplified resists
Mack, C.; Ercken, Monique; Moelants, Myriam (1999) -
Measurement and evaluation of water uptake by resists, top coats and stacks and correlation with watermark defects
Foubert, Philippe; Kocsis, Michael; Gronheid, Roel; Kishimura, Shinji; Soyano, Akimasa; Nafus, Kathleen; Stepanenko, Nickolay; De Backer, Johan; Vandenbroeck, Nadia; Ercken, Monique (2007) -
Modelling the lithography of ion implantation resists on topography
Winroth, Gustaf; Vaglio Pret, Alessandro; Ercken, Monique; Robertson, Stewart; Biafore, John J. (2014) -
Molecular base sensitivity studies of various DUV resists used in semiconductor fabrication
Ruede, David; Ercken, Monique; Borgers, Tom (2001) -
NMOS and PMOS triple gate devices with mid-gap metal gate on oxynitride and Hf based gate dielectrics
Henson, Kirklen; Collaert, Nadine; Demand, Marc; Goodwin, Michael; Brus, Stephan; Rooyackers, Rita; Van Ammel, Annemie; Degroote, Bart; Ercken, Monique; Baerts, Christina; Kottantharayil, Anil; Dixit, Abhisek; Beckx, Stephan; Schram, Tom; Deweerd, Wim; Boullart, Werner; Schaekers, Marc; De Gendt, Stefan; De Meyer, Kristin; Yim, Yong Sik; Hooker, Jacob; Jurczak, Gosia; Biesemans, Serge (2005) -
Novel process to pattern selectively dual dielectric capping layers using soft-mask only
Schram, Tom; Kubicek, Stefan; Rohr, Erika; Brus, Stephan; Vrancken, Christa; Chang, Shou-Zen; Chang, V.S.; Mitsuhashi, Riichiru; Okuno, Yasutoshi; Akheyar, Amal; Cho, Hag-Ju; Hooker, J.C.; Paraschiv, Vasile; Vos, Rita; Sebaai, Farid; Ercken, Monique; Kelkar, Prasad; Delabie, Annelies; Adelmann, Christoph; Witters, Thomas; Ragnarsson, Lars-Ake; Kerner, Christoph; Chiarella, Thomas; Aoulaiche, Marc; Cho, Moon Ju; Kauerauf, Thomas; De Meyer, Kristin; Lauwers, Anne; Hoffmann, Thomas Y.; Absil, Philippe; Biesemans, Serge (2008) -
On the scalability of source/drain current enhancement in thin film sSOI
Augendre, Emmanuel; Eneman, Geert; De Keersgieter, An; Simons, Veerle; De Wolf, Ingrid; Ramos, Javier; Brus, Stephan; Pawlak, Bartek; Severi, Simone; Leys, Frederik; Sleeckx, Erik; Locorotondo, Sabrina; Ercken, Monique; de Marneffe, Jean-Francois; Fei, Lu; Seacrist, Mike; Kellerman, Bruce; Goodwin, Michael; Jurczak, Gosia; Biesemans, Serge (2005) -
Optimization of scatterometry parameters for shallow trench isolation (STI) monitor
Leray, Philippe; Cheng, Shaunee; Kremer, Stephanie; Ercken, Monique; Pollentier, Ivan (2004) -
Patterning challenges for beyond 3nm logic devices: Example of an interconnected magnetic tunnel junction
Thiam, Arame; Wan, Danny; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Swerts, Johan; Couet, Sebastien; Raymenants, Eline; Jussot, Julien; Trivkovic, Darko; Ercken, Monique; Wilson, Chris; Radu, Iuliana (2019) -
Patterning challenges in setting up a 16nm node 6T-SRAM device using EUV lithography
Vandeweyer, Tom; De Backer, Johan; Versluijs, Janko; Truffert, Vincent; Verhaegen, Staf; Ercken, Monique; Dusa, Mircea (2011) -
Patterning developments in spin-on hard mask systems for 30nm half pitch EUV technology
Truffert, Vincent; Pollentier, Ivan; Foubert, Philippe; Lazzarino, Frederic; Wilson, Chris; Ercken, Monique; Gronheid, Roel; Demuynck, Steven; Buch, Xavier; Anno, Yusuke (2012) -
Performance verification of resist loss measurement method using top-view CD-SEM images for hyper-NA lithography
Osaki, Mayuka; Tanaka, Maki; Shishido, Chie; Cheng, Shaunee; Laidler, David; Ercken, Monique; Altamirano Sanchez, Efrain (2009) -
Precuring implant photoresists for shrink and patterning control
Winroth, Gustaf; Rosseel, Erik; Delvaux, Christie; Altamirano Sanchez, Efrain; Ercken, Monique (2013) -
Process development using negative tone development for the dark field critical layers in a 28 nm node process
Versluijs, Janko; Truffert, Vincent; Murdoch, Gayle; De Bisschop, Peter; Trivkovic, Darko; Wiaux, Vincent; Kunnen, Eddy; Souriau, Laurent; Demuynck, Steven; Ercken, Monique (2012) -
Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations
Vega Gonzalez, Victor; Montero Alvarez, Daniel; Versluijs, Janko; Varela Pedreira, Olalla; Jourdan, Nicolas; Puliyalil, Harinarayanan; Chehab, Bilal; Peissker, Tobias; Haider, Ali; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Le, Quoc Toan; Bazzazian, Nina; Heylen, Nancy; van der Veen, Marleen; El-Mekki, Zaid; Webers, Tomas; Vats, H.; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Gillijns, Werner; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Ciofi, Ivan; De Wachter, Bart; Swerts, Johan; Grieten, Eva; Ercken, Monique; Kim, Ryan Ryoung han; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Nagesh, Nishanth; Ramakers, Leon; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021) -
Progress in ArF immersion lithography
Ronse, Kurt; Cheng, Shaunee; Ercken, Monique; Leunissen, Peter; Maenhoudt, Mireille; Vandenberghe, Geert (2005) -
Progress in qualifying and quantifying the airborne base sensitivity of modern chemically amplified DUV photoresists
Kinkead, D. A.; Ercken, Monique (2000) -
Resist profile control in immersion lithography using scatterometry measurements
Pollentier, Ivan; Ercken, Monique; Foubert, Philippe; Cheng, Shaunee (2005) -
Spin torque majority gate devices: towards 300mm wafer integration
Manfrini, Mauricio; Vaysset, Adrien; Ciubotaru, Florin; Yan, Jingdong; Radisic, Dunja; Ercken, Monique; Trivkovic, Darko; Swerts, Johan; Briggs, Basoene; Wilson, Chris; Lin, Dennis; Mocuta, Anda; Nikovov, D.E; Sayan, S; Manipatruni, S.; Young, I. A.; Radu, Iuliana; Thean, Aaron (2016)